Thermal - Accessories

Part Number	Description / PDF	Quantity
HPLC-BP1 Wakefield-Vette	BYPASS KIT FOR HPLC-10 HPLC-20	6
LP4C-38-B-M-R Wakefield-Vette	LIQUID CONN 3/8HB VALVED INSERT	10
QB0805A40ESC7 American Technical Ceramics	THERMAL CONDUCTOR Q-BRIDGE	0
TG4040-D-GUN t-Global Technology	DISPENSE GUN FOR 30CC SYRINGE	5
QB0603A25ESTB American Technical Ceramics	THERMAL CONDUCTOR Q-BRIDGE	0
MAX07NG Aavid	MAX CLIP TO-220/MAX220 SCREW-MNT	44984
L-SANS-8-1/8 Laird Thermal Systems	THERMOELECT MOD I CONNECTOR 1/8	29
QB0302B20ESTB American Technical Ceramics	THERMAL CONDUCTOR Q-BRIDGE	0
330SC Wakefield-Vette	SPEEDCLIP S/S FOR 667 SERIES	0
THJP0612AST1 Vishay	THERMAL JUMPER 0612 30 MIL LEAD-	0
QB0505A25ESTB American Technical Ceramics	THERMAL CONDUCTOR Q-BRIDGE	0
ATS-SG330-R0 Advanced Thermal Solutions, Inc.	SUPERGRIP CLIP KIT 33X33MM	180
LP6C-50-B-M-R Wakefield-Vette	LIQUID CONN 1/2HB VALVED INSERT	9
4880G Aavid	MOUNTING KIT TO-220	1682
HSC-02 CUI Devices	HEAT SINK CLIP FOR HSE-BX-035H S	1000
ATS-MG375-R0 Advanced Thermal Solutions, Inc.	MAXIGRIP CLIP KIT 37.5X37.5MM	184
THJP1225AST1 Vishay	THERMAL JUMPER 1225 30 MIL LEAD-	1372
LP4C-25-SAE-M-B Wakefield-Vette	LIQUID CONN 1/4SAE VALVED INSERT	10
ATS-HK127-R0 Advanced Thermal Solutions, Inc.	HEATSINK PLASTIC PIN/SPRING 1=2	391
QB0805B40ESS3 American Technical Ceramics	THERMAL CONDUCTOR Q-BRIDGE	0

Thermal - Accessories

1. Overview

Thermal accessories are critical components in thermal management systems, designed to dissipate heat and maintain optimal operating temperatures for electronic devices. These accessories include fans, heat sinks, thermal interface materials, and related components that ensure efficient heat transfer and system reliability. With increasing power densities in modern electronics, effective thermal management has become essential for performance, longevity, and safety across industries such as computing, telecommunications, and automotive.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
DC/AC Fans	Active cooling via airflow generation, variable speed control	PC cooling, server racks, industrial machinery
Heat Sinks	Passive heat dissipation through conductive materials	CPU/GPU cooling, power electronics, LED lighting
Thermal Pads/Grease	Fill gaps between components and heat sinks for improved conduction	Motherboards, automotive electronics, handheld devices
Heat Pipes	High-efficiency phase-change heat transfer	Laptops, aerospace systems, industrial lasers
Fan Ducts/Shrouds	Direct airflow to specific components	Data center cooling, automotive radiators

3. Structure and Components

Typical thermal accessories combine mechanical and thermal engineering principles:

Fans: Motor-driven blades (plastic/metal), bearing systems (sleeve/ball), housing with mounting features
Heat Sinks: Base plate (aluminum/copper) with extended fins, surface treatments (anodization, plating)
Thermal Interface Materials: Silicone-based compounds, phase-change materials, or graphite sheets with controlled thickness
Heat Pipes: Sealed copper tubes with wick structures and working fluids (water, ammonia)

4. Key Technical Specifications

Parameter	Description	Importance
Thermal Resistance ( C/W)	Material's ability to conduct heat	Determines cooling efficiency
Airflow (CFM)	Volumetric air movement capacity	Impacts active cooling performance
Noise Level (dBA)	Acoustic emissions during operation	Critical for user experience
MTBF (hours)	Mean Time Between Failures	Indicates product reliability
Dimensions (mm)	Physical size constraints	Key for system integration

5. Application Fields

Consumer Electronics: Gaming consoles, laptops, smartphones
Industrial: CNC machines, power inverters, robotics
Telecom: 5G base stations, network switches, optical transceivers
Automotive: EV battery cooling, onboard chargers, radar systems
Aerospace: Avionics cooling, satellite thermal control

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Delta Electronics	AFB1212SH	4000 RPM industrial fan with IP52 rating
Cooler Master	Hyper 212 RGB	Tower heat sink with multiple heat pipes
Aavid (TE Connectivity)	Thermal Gap Pad 1500	1.5W/mK conductivity, 0.5mm thickness
Noctua	NH-U12S Redux	Low-noise PC CPU cooler

7. Selection Recommendations

Key considerations include:

Thermal requirements (power dissipation, operating temperature range)
Environmental factors (dust, humidity, vibration)
Space constraints and mounting options
Noise limitations for end-user applications
Cost vs. performance trade-offs
Reliability needs (e.g., industrial vs. consumer use)

8. Industry Trends

Emerging developments include:

Miniaturization for 5G and IoT devices
Smart thermal systems with IoT-enabled sensors
Advanced materials (graphene, vapor chambers)
Energy-efficient fans with BLDC motors
AI-driven thermal management algorithms
Increased adoption of liquid cooling in high-power applications