Thermal - Accessories

Image Part Number Description / PDF Quantity Rfq
MAX08NG

MAX08NG

Aavid

MAX CLIP TO-218/TO-247 SCREW-MNT

60839

LP4C-25-B-F-B

LP4C-25-B-F-B

Wakefield-Vette

LIQUID CONN 1/4HB VALVED BODY

10

NTE415

NTE415

NTE Electronics, Inc.

TRANS.INSULATOR KIT TO-66

217

ATS-PPS-17

ATS-PPS-17

Advanced Thermal Solutions, Inc.

HEATSINK MUSIC WR SPRING 4.06MM

0

ATS-PPS-05

ATS-PPS-05

Advanced Thermal Solutions, Inc.

HEATSINK SS SPRING 3.73MM

2907

QB0302A20ESTB

QB0302A20ESTB

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

ATS-PPS-10

ATS-PPS-10

Advanced Thermal Solutions, Inc.

HEATSINK MUSIC WR SPRING 4.22MM

0

ATS-MG450-R0

ATS-MG450-R0

Advanced Thermal Solutions, Inc.

MAXIGRIP CLIP KIT 45X45MM

108

MAX03-HNG

MAX03-HNG

Aavid

MAX CLIP TO-247/MAX247 HIGHFORCE

32467

QB0505B25WYC7

QB0505B25WYC7

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

4640

4640

Keystone Electronics Corp.

INSULATOR MICA 1.300X.810"D PLAS

2600

QB0805B40ESTD

QB0805B40ESTD

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

QB0505A25WYC7

QB0505A25WYC7

American Technical Ceramics

THERMAL CONDUCTOR Q-BRIDGE

0

MGT375

MGT375

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 37.5X37.5

0

ATS-PP-05

ATS-PP-05

Advanced Thermal Solutions, Inc.

HEATSINK BRASS PUSH PIN 13MM

1601

125700D00000G

125700D00000G

Aavid

SOLDER ANCHOR FOR BGA HEATSINKS

15115

THJP0805AST1

THJP0805AST1

Vishay

THERMAL JUMPER 0805 30 MIL LEAD-

409

LP4C-38-SAE-F-B

LP4C-38-SAE-F-B

Wakefield-Vette

LIQUID CONN 3/8SAE VALVED BODY

5

4724

4724

Keystone Electronics Corp.

KIT MOUNTING HARDWARE TO-220

5684222

MGT310

MGT310

Advanced Thermal Solutions, Inc.

TOOL FOR MAXI GRIP 31X31

9

Thermal - Accessories

1. Overview

Thermal accessories are critical components in thermal management systems, designed to dissipate heat and maintain optimal operating temperatures for electronic devices. These accessories include fans, heat sinks, thermal interface materials, and related components that ensure efficient heat transfer and system reliability. With increasing power densities in modern electronics, effective thermal management has become essential for performance, longevity, and safety across industries such as computing, telecommunications, and automotive.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
DC/AC FansActive cooling via airflow generation, variable speed controlPC cooling, server racks, industrial machinery
Heat SinksPassive heat dissipation through conductive materialsCPU/GPU cooling, power electronics, LED lighting
Thermal Pads/GreaseFill gaps between components and heat sinks for improved conductionMotherboards, automotive electronics, handheld devices
Heat PipesHigh-efficiency phase-change heat transferLaptops, aerospace systems, industrial lasers
Fan Ducts/ShroudsDirect airflow to specific componentsData center cooling, automotive radiators

3. Structure and Components

Typical thermal accessories combine mechanical and thermal engineering principles:

  • Fans: Motor-driven blades (plastic/metal), bearing systems (sleeve/ball), housing with mounting features
  • Heat Sinks: Base plate (aluminum/copper) with extended fins, surface treatments (anodization, plating)
  • Thermal Interface Materials: Silicone-based compounds, phase-change materials, or graphite sheets with controlled thickness
  • Heat Pipes: Sealed copper tubes with wick structures and working fluids (water, ammonia)

4. Key Technical Specifications

ParameterDescriptionImportance
Thermal Resistance ( C/W)Material's ability to conduct heatDetermines cooling efficiency
Airflow (CFM)Volumetric air movement capacityImpacts active cooling performance
Noise Level (dBA)Acoustic emissions during operationCritical for user experience
MTBF (hours)Mean Time Between FailuresIndicates product reliability
Dimensions (mm)Physical size constraintsKey for system integration

5. Application Fields

  • Consumer Electronics: Gaming consoles, laptops, smartphones
  • Industrial: CNC machines, power inverters, robotics
  • Telecom: 5G base stations, network switches, optical transceivers
  • Automotive: EV battery cooling, onboard chargers, radar systems
  • Aerospace: Avionics cooling, satellite thermal control

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Delta ElectronicsAFB1212SH4000 RPM industrial fan with IP52 rating
Cooler MasterHyper 212 RGBTower heat sink with multiple heat pipes
Aavid (TE Connectivity)Thermal Gap Pad 15001.5W/mK conductivity, 0.5mm thickness
NoctuaNH-U12S ReduxLow-noise PC CPU cooler

7. Selection Recommendations

Key considerations include:

  • Thermal requirements (power dissipation, operating temperature range)
  • Environmental factors (dust, humidity, vibration)
  • Space constraints and mounting options
  • Noise limitations for end-user applications
  • Cost vs. performance trade-offs
  • Reliability needs (e.g., industrial vs. consumer use)

8. Industry Trends

Emerging developments include:

  • Miniaturization for 5G and IoT devices
  • Smart thermal systems with IoT-enabled sensors
  • Advanced materials (graphene, vapor chambers)
  • Energy-efficient fans with BLDC motors
  • AI-driven thermal management algorithms
  • Increased adoption of liquid cooling in high-power applications
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