Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
MIO-5272U-U4A1E

MIO-5272U-U4A1E

Advantech

6TH GEN INTELCORE U-SERIES

0

SOM-5890Z-S5A1E

SOM-5890Z-S5A1E

Advantech

INTEL I7-2610UE 1.5GHZ W/PHOENIX

0

ARK-5261I-J0A1E

ARK-5261I-J0A1E

Advantech

ARK-5261 J1900 EMBEDDED BOX PC

0

PCA-6011VG-00A1E

PCA-6011VG-00A1E

Advantech

LGA775 C2Q/C2D/P4/CELERON PICMG

0

RSB-3850CS-GPA1E

RSB-3850CS-GPA1E

Advantech

INTEL QUARK X1000 400MHZ

0

SOM-6897C7-U6A1E

SOM-6897C7-U6A1E

Advantech

INTEL I7-6600U 2.6GHZ

0

ITA-3711-00A1E

ITA-3711-00A1E

Advantech

ITA-3711 J1900,4G DDR3, W/2 PCI,

0

MIC-7700H-00A1

MIC-7700H-00A1

Advantech

MIC-7700,H110, VGA+DVI, 4 COM, 4

0

ASMB-785G4-00A1E

ASMB-785G4-00A1E

Advantech

LGA 1151 INTEL XEON E3 V5/ 6TH

0

TREK-550-GXPEA1E

TREK-550-GXPEA1E

Advantech

INTEL ATOM XL Z510PT 1.1GHZ, GPS

0

AIMB-505G2-00A1E

AIMB-505G2-00A1E

Advantech

LGA1151 MATX DP/DVI/EDP/SATAIII/

0

PCM-9375E-J0A3

PCM-9375E-J0A3

Advantech

SBC 3.5" LX800 24BIT LVDS TFT

0

TREK-773R-LWB8B0E

TREK-773R-LWB8B0E

Advantech

TREK-773R W/LTE US /GPS/WLAN/BT/

0

SOM-5790FG-U1A1E

SOM-5790FG-U1A1E

Advantech

INTEL QM67 COM EXPRESS I7-2715QE

0

DS-061GB-S7A1E

DS-061GB-S7A1E

Advantech

SIGNAGE BOX WITH IVY BRIDGE I7-3

0

ROM-5420CD-MDB1E

ROM-5420CD-MDB1E

Advantech

I.MX6 DC 1GHZ, 1GB DRAM, 4GB EMM

0

MIC-7500-U0A1E

MIC-7500-U0A1E

Advantech

MIC-7500 FANLESS SYSTEM I7-6822E

0

SOM-6897CR-U0A1E

SOM-6897CR-U0A1E

Advantech

CELERON 3955U

0

SNMP-1000-E2B2E

SNMP-1000-E2B2E

Advantech

SNMP/HTTP REMOTE SYSTEM MANAGER

0

SOM-4463N-S6B2E

SOM-4463N-S6B2E

Advantech

INTEL ATOM N455 ETX MODULE

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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