| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Advantech |
ITA-1610 ATOM D525 2G DDR3 2COM |
0 |
|
|
Advantech |
AMD G- SERIES T40R MIO SBC DDR3 |
0 |
|
|
Advantech |
COMPACT FANLESS EMBEDDED IPC |
0 |
|
|
Advantech |
MITX W/I7-6820EQ+QM170, 2DP/HDMI |
0 |
|
|
Advantech |
N4200/F1, 1.1GHZ, 4C6W, COME MIN |
4 |
|
|
Advantech |
INTEL CELERON N2930 3.5" SBC |
0 |
|
|
Advantech |
COMPACT FANLESS EMBEDDED IPC |
0 |
|
|
Advantech |
MIC-7900 FANLESS SYSTEM |
0 |
|
|
Advantech |
INTEL I3-6102E, 1.9 GHZ, 2C, 25W |
0 |
|
|
Advantech |
PENTIUM D1508 2.2GHZ 2C |
0 |
|
|
Advantech |
CIRC BRD ATOM BAYTRAIL QC1.86G |
0 |
|
|
Advantech |
ITA-1711 J1900 4G DDR3 2VGA |
0 |
|
|
Advantech |
EMB UTX-3117 N4200 W/4ANT/4G RAM |
0 |
|
|
Advantech |
I.MX6 QC 1.0GHZ |
5 |
|
|
Advantech |
PENTIUM D1508, 2.2 GHZ, 2C, 25W |
0 |
|
|
Advantech |
TREK-306 DISPLAY HOOD |
0 |
|
|
Advantech |
6TH GEN INTEL CORE U-SERIES I7 |
0 |
|
|
Advantech |
32" PCT.T/S PANEL HASWELL I5-43 |
0 |
|
|
Advantech |
EPC-T2285 BAREBONE W/CPU G3900 |
0 |
|
|
Advantech |
QUALCOMM APQ-8016 ARM BOX COMPUT |
0 |
|
Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| SBC (e.g., Raspberry Pi) | Complete system with CPU, RAM, storage, and I/O interfaces | Smart home devices, educational tools |
| COM (e.g., COM Express) | Modular design with processor, memory, and basic I/O; requires carrier board | Medical imaging systems, industrial controllers |
| Industrial SBC | Ruggedized components for harsh environments | Factory automation, outdoor kiosks |
A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.
| Parameter | Description | Importance |
|---|---|---|
| CPU Performance | Measured in DMIPS or GHz | Determines processing capability |
| Thermal Design Power (TDP) | Power consumption in watts | Impacts cooling requirements |
| Interface Types | USB 3.0, PCIe, CAN, etc. | Dictates peripheral compatibility |
| Operating Temperature | -40 C to +85 C range | Defines environmental tolerance |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Raspberry Pi Foundation | Raspberry Pi 4 Model B | Quad-core Cortex-A72, 4K HDMI |
| Intel | COM Express modules | 11th Gen Core processors, PCIe 4.0 |
| NVIDIA | JETSON AGX Xavier | AI accelerator, 32 TOPS performance |
| Advantech | AIMB-236 SBC | Intel Atom x6425E, -20 C to 70 C operation |
Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.
Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.