Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
DS-980GL-00A1E

DS-980GL-00A1E

Advantech

INTEL SKYLAKE-S, BAREBONE W/O PC

0

ARK-2150L-S6A1E

ARK-2150L-S6A1E

Advantech

COMPACT FANLESS EMBEDDED IPC

0

AIMB-231G2Z-U5A1E

AIMB-231G2Z-U5A1E

Advantech

DC MINIITX BROADWELL-U I5-5350

0

UTC-532D-PE

UTC-532D-PE

Advantech

32" PCT.T/S PANEL WITH BAYTRAIL

0

PCE-5B19-00A1E

PCE-5B19-00A1E

Advantech

19-SLOTS PICMG1.3BP 1 CPU CARD

0

ITA-5730-00A1E

ITA-5730-00A1E

Advantech

ITA-5730 I7-3555LE+HM76 4G DDR3

0

SOM-3568BM0C-S1A1E

SOM-3568BM0C-S1A1E

Advantech

INTELATOM X5-E8000, 2GB MEM

0

PCM-3353Z-L0A1E

PCM-3353Z-L0A1E

Advantech

PC104+ SBCW/LX800 FLASH TTL/LVDS

0

SOM-5898C7-H0A1

SOM-5898C7-H0A1

Advantech

MOD I7-7820EQ 3.0GHZ

0

UTC-542FP-ATB0E

UTC-542FP-ATB0E

Advantech

42.5", INTEL SKYLAKE COREI5-6300

0

RSB-4221CS-MCA1E

RSB-4221CS-MCA1E

Advantech

TI SITARA AM3358 1.0GHZ

0

HIT-R151FR-APW1E

HIT-R151FR-APW1E

Advantech

HIT-R151F FREESCALE 15.6" 1GB

0

AIMB-231G2-U3A1E

AIMB-231G2-U3A1E

Advantech

CIRC BRD DC MINIITX HASWELL-ULT

0

PCM-9363NZ21GS6A1E

PCM-9363NZ21GS6A1E

Advantech

3.5" INTEL ATOM N455 SBC DDR3

0

SOM-5890FG-S3A1E

SOM-5890FG-S3A1E

Advantech

INTEL QM67 COM EXPRESS I3-2340UE

0

PCI-7032VG-00A1E

PCI-7032VG-00A1E

Advantech

PCI-7032 PCI HS SBC ATOM N2930

0

AIMB-567VG-00A2E

AIMB-567VG-00A2E

Advantech

CIRC BRD C2Q LGA775 MATX IMB

0

TREK-773R-00A0E

TREK-773R-00A0E

Advantech

TREK-773R INTEL BYT E3826 BAREBO

0

ASMB-782G2-00A1E

ASMB-782G2-00A1E

Advantech

ATX SOCKET 1155 SERVER BOARD

0

PCM-9310CQ-S6A1E

PCM-9310CQ-S6A1E

Advantech

INTELCELERON N3160 SOC

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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