Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
MIO-5290U-S6A1E

MIO-5290U-S6A1E

Advantech

SBC I3 3217UE 1.6GHZ SODIMM

0

AIMB-215D-S6B1E

AIMB-215D-S6B1E

Advantech

MOTHERBOARD CELERON J1900 2.0GHZ

0

UBC-200CD-MDA1E

UBC-200CD-MDA1E

Advantech

COMPUTER ARM I.MX6 1GHZ 1GB DDR3

1

AIMB-273G2-00A1E

AIMB-273G2-00A1E

Advantech

MOTHERBOARD I CORE QM77 MINI-ITX

0

PCM-9376E-M0A1E

PCM-9376E-M0A1E

Advantech

SBC AMD T16R 615MHZ SODIMM

0

AIMB-215N-S6B1E

AIMB-215N-S6B1E

Advantech

MOTHERBOARD CELERON N2930 1.83GH

0

ARK-1550-S9A1E

ARK-1550-S9A1E

Advantech

FANLESS PC INTEL I5 4300 1.9GHZ

4

MIO-5271U-S6A1E

MIO-5271U-S6A1E

Advantech

SBC CELERON 2980U 1.6GHZ SODIMM

0

PCM-9363D-S8A1E

PCM-9363D-S8A1E

Advantech

SBC ATOM D525 1.8GHZ SODIMM

0

DS-370GF-U0A1E

DS-370GF-U0A1E

Advantech

SIGNAGE CELERON J1900 2.0GHZ

0

AIMB-274G2-00A1E

AIMB-274G2-00A1E

Advantech

MOTHERBOARD I CORE Q87 MINI-ITX

0

MIO-5270DZ22GS0A1E

MIO-5270DZ22GS0A1E

Advantech

SBC AMD T40E 1.0GHZ 2GB BUNDLE

0

AIMB-584QG2-00A1E

AIMB-584QG2-00A1E

Advantech

MOTHERBOARD I CORE Q87 MATX

0

MIO-2263JH-U0A1E

MIO-2263JH-U0A1E

Advantech

SBC CELERON J1900 2.0GHZ SODIMM

4

UBC-200CQ-MEA1E

UBC-200CQ-MEA1E

Advantech

COMPUTER ARM I.MX6 1GHZ 2GB DDR3

0

UNO-420-E0A

UNO-420-E0A

Advantech

INTEL ATOM POE POWERED DEVICE SE

0

DS-063GB-S8A1E

DS-063GB-S8A1E

Advantech

SIGNAGE ATOM D2550 1.066GHZ

0

MIO-5270D-S6A1E

MIO-5270D-S6A1E

Advantech

SBC AMD T56N 1.65GHZ SODIMM

0

AIMB-223G2-S1A1E

AIMB-223G2-S1A1E

Advantech

MOTHERBOARD AMD T40E 1.0GHZ

0

MIO-5251E-S3A1E

MIO-5251E-S3A1E

Advantech

SBC ATOM E3825 1.33GHZ SODIMM

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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