Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
SC40-2020-0000-C0-V

SC40-2020-0000-C0-V

UDOO

SBC UDOO BOLTV8 RYZENV1605B 32GB

37

SA69-0200-1100-C0

SA69-0200-1100-C0

UDOO

UDOO NEO FULL SBC 1GB RAM

163

SB02-3740-0000-C1

SB02-3740-0000-C1

UDOO

SBC UDOO X86 ADVANCED PLUS

98

SA69-0200-1000-C0

SA69-0200-1000-C0

UDOO

UDOO NEO EXTND SBC 1GB RAM

2

KTMX-UDOOBL-V8G.00

KTMX-UDOOBL-V8G.00

UDOO

SBC UDOO BOLT GEAR W/CASE

228

SA69-0100-0100-C0

SA69-0100-0100-C0

UDOO

UDOO NEO BASIC SBC 512MB RAM

3

SB02-4940-0000-C1

SB02-4940-0000-C1

UDOO

SBC UDOO X86 ULTRA W/INTEL N3

121

S975-B000-2000-C2

S975-B000-2000-C2

UDOO

UDOO BASIC - EDUCATIONAL OPENSOU

0

SC40-1000-0000-C0-V

SC40-1000-0000-C0-V

UDOO

SBC UDOO BOLTV3 RYZENV1202B 32GB

42

SB02-7400-0000-C0

SB02-7400-0000-C0

UDOO

SBC - UDOO X86 BASIC W/ INTEL X5

0

UDOO DUAL

UDOO DUAL

UDOO

UDOO DUAL CORE SBC OPENSOURCE

0

SB02-3740-0000-C0

SB02-3740-0000-C0

UDOO

SBC - UDOO X86 ADVANCED PLUS W/

0

UDOO QUAD

UDOO QUAD

UDOO

UDOO QUAD CORE SBC OPENSOURCE

0

SB02-3700-0000-C0

SB02-3700-0000-C0

UDOO

SBC - UDOO X86 ADVANCED W/ INTEL

0

SB02-4940-0000-C0

SB02-4940-0000-C0

UDOO

SBC - UDOO X86 ULTRA W/ INTEL N3

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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