Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
SC0287

SC0287

Raspberry Pi

COMPUTE 4 2GB RAM 0GB LITE

0

RASPBERRY PI 3

RASPBERRY PI 3

Raspberry Pi

RASPBERRY PI 3 MODEL B BCM2837

2601

SC0298

SC0298

Raspberry Pi

COMPUTE 4 8GB RAM 32GB EMMC

0

SC0293

SC0293

Raspberry Pi

COMPUTE 4 4GB RAM 16GB EMMC

169

SC0372

SC0372

Raspberry Pi

PI 400 UK

91

SC0388

SC0388

Raspberry Pi

PI 400 ES KIT

0

SC0290

SC0290

Raspberry Pi

COMPUTE 4 2GB RAM 32GB EMMC

0

SC0376

SC0376

Raspberry Pi

PI 400 IT

0

SC0283

SC0283

Raspberry Pi

COMPUTE 4 8GB RAM 0GB LITE WIFI

0

SC0374

SC0374

Raspberry Pi

PI 400 DE

0

SC0295

SC0295

Raspberry Pi

COMPUTE 4 8GB RAM 0GB LITE

0

SC0317

SC0317

Raspberry Pi

COMPUTE 4 1GB RAM 32GB EMMC WIFI

0

CM3+ DEV. KIT

CM3+ DEV. KIT

Raspberry Pi

RASPBERRY PI COMPUTE 3+ KIT

66

SC0291

SC0291

Raspberry Pi

COMPUTE 4 4GB RAM 0GB LITE

0

SC0314

SC0314

Raspberry Pi

COMPUTE 4 1GB RAM 0GB LITE WIFI

0

RASPBERRY PI B+

RASPBERRY PI B+

Raspberry Pi

RASPBERRY PI MODEL B+ BCM2835

176

SC0296

SC0296

Raspberry Pi

COMPUTE 4 8GB RAM 8GB EMMC

0

SC0385

SC0385

Raspberry Pi

PI 400 DE KIT

0

RASPBERRY PI 3 A+

RASPBERRY PI 3 A+

Raspberry Pi

RASPBERRY PI 3 MOD A+ BCM2837B0

1988

RASPBERRY PI 4 MODEL B 8G

RASPBERRY PI 4 MODEL B 8G

Raspberry Pi

RASPBERRY PI 4 MODEL B 8GB SDRAM

313

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

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