Single Board Computers (SBCs), Computer On Module (COM)

Image Part Number Description / PDF Quantity Rfq
20-101-0412

20-101-0412

Digi

DISPLAY GRAPHIC 12KEY PROG OP670

0

20-101-0788

20-101-0788

Digi

COMPUTER SGL-BOARD OP6600 W/SRAM

0

101-0677

101-0677

Digi

COMPUTER SGL-BRD BL2000 MEM/FLSH

0

101-0525

101-0525

Digi

COMPUTER SINGLE-BOARD LP3500 FOX

0

101-0565

101-0565

Digi

COMPUTER SNGL BD BL2100 BOTT MNT

0

101-0840

101-0840

Digi

COMPUTER BL2000 FRCTN 512K SRAM

0

101-0862

101-0862

Digi

COMPUTER SGL-BD BL2020 SRAM/FLSH

0

101-0464

101-0464

Digi

COMPUTER SINGLE BOARD BL2130

0

20-101-0185

20-101-0185

Digi

MODULE SBC FWT38

0

101-0725

101-0725

Digi

COMPUTER SGL-BRD BL2010 W/FLASH

0

20-101-0464

20-101-0464

Digi

COMPUTER SINGLE-BOARD BL2130

0

101-0558

101-0558

Digi

COMPUTER SNG BD BL1800 512K SRAM

0

101-0555

101-0555

Digi

COMPUTER SNGLBD BL2000 FRCTNLOCK

0

101-0596

101-0596

Digi

COMPUTER SNGL BD BL2030 BOTT MNT

0

101-1045

101-1045

Digi

BL2600 NAND XD 10/100

0

20-101-0594

20-101-0594

Digi

COMPUTER BL2020 W/FRICTION LOCK

0

101-0718

101-0718

Digi

COMPUTER SGL-BRD BL2030 MEM/FLSH

0

101-0412

101-0412

Digi

INTERFACE PROG 12KEY DISP OP6700

0

20-101-0568

20-101-0568

Digi

COMPUTER SGL-BD BL2100 512K FLSH

0

101-0556

101-0556

Digi

COMPUTER SNGL BD BL2000 IDC HDR

0

Single Board Computers (SBCs), Computer On Module (COM)

1. Overview

Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
SBC (e.g., Raspberry Pi)Complete system with CPU, RAM, storage, and I/O interfacesSmart home devices, educational tools
COM (e.g., COM Express)Modular design with processor, memory, and basic I/O; requires carrier boardMedical imaging systems, industrial controllers
Industrial SBCRuggedized components for harsh environmentsFactory automation, outdoor kiosks

3. Structure and Components

A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.

4. Key Technical Specifications

ParameterDescriptionImportance
CPU PerformanceMeasured in DMIPS or GHzDetermines processing capability
Thermal Design Power (TDP)Power consumption in wattsImpacts cooling requirements
Interface TypesUSB 3.0, PCIe, CAN, etc.Dictates peripheral compatibility
Operating Temperature-40 C to +85 C rangeDefines environmental tolerance

5. Application Areas

  • Industrial: CNC machines, PLC controllers
  • Healthcare: Patient monitoring systems, diagnostic equipment
  • Transportation: In-vehicle infotainment, ADAS
  • Smart Cities: Surveillance cameras, environmental sensors

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Raspberry Pi FoundationRaspberry Pi 4 Model BQuad-core Cortex-A72, 4K HDMI
IntelCOM Express modules11th Gen Core processors, PCIe 4.0
NVIDIAJETSON AGX XavierAI accelerator, 32 TOPS performance
AdvantechAIMB-236 SBCIntel Atom x6425E, -20 C to 70 C operation

7. Selection Guidelines

Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.

8. Industry Trends

Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.

RFQ BOM Call Skype Email
Top