| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
iBASE Technology |
COM EXPRESS (TYPE 6), INTEL CORE |
1 |
|
 |
SLS18MP157A_650C_512R_04GE_1WB_C SoMLabs |
VISIONSOM MODULE, STM32MP157A @ |
0 |
|
 |
iBASE Technology |
ITX, INTEL CORE I7-8850H (2.6GHZ |
1 |
|
 |
Digi |
COMPUTER SINGLE-BOARD BL4S210 |
46 |
|
 |
congatec |
CPU BOARD INTEL ATOM 1.6GHZ |
1 |
|
 |
iEi Technology |
1U RACKMOUNT NETWORK APPLIANCE W |
82 |
|
 |
congatec |
CPU BOARD NXP MX8 1XARM |
0 |
|
 |
VersaLogic Corporation |
I3-6100U 2.3 GHZ / NA 8 GB |
1 |
|
 |
congatec |
CPU BOARD INTEL PENTIUM N4200 |
1 |
|
 |
VersaLogic Corporation |
EMBEDDED PROCESSING UNIT |
7 |
|
 |
iBASE Technology |
(DS), ARM-BASED SIGNAGE PLAYER W |
1 |
|
 |
iBASE Technology |
ITX, LGA1151 CORE I7/I5/I3, PENT |
1 |
|
 |
SolidRun |
SBC GATE CARRIER DUAL LT IMX6 |
0 |
|
 |
iBASE Technology |
(ASB), CHASSIS WITH IB908AF-4300 |
1 |
|
 |
congatec |
CPU BOARD INTEL XENON 2.0GHZ |
1 |
|
 |
iBASE Technology |
QSEVEN CPU MODULE, INTEL X5-E39 |
1 |
|
 |
iBASE Technology |
ITX, INTEL CORE I5-7440EQ (2.9GH |
1 |
|
 |
SolidRun |
SOM QUAD PRO AUTO TEMP 2GB 1GHZ |
0 |
|
 |
congatec |
CPU BOARD QSEVEN NXP MX8 1XARM |
0 |
|
 |
Boundary Devices |
NITROGEN8M: I.MX8M QUAD / 2GB RA |
0 |
|
Embedded computers are specialized computing systems designed for specific tasks within larger mechanical or electrical systems. Single Board Computers (SBCs) integrate all computer components on a single circuit board, providing a compact and self-contained solution. Computer On Module (COMs) are standardized modules containing core computing components, designed to be integrated into carrier boards for customized applications. These technologies are critical in industrial automation, IoT, robotics, and edge computing due to their reliability, scalability, and space efficiency.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| SBC (e.g., Raspberry Pi) | Complete system with CPU, RAM, storage, and I/O interfaces | Smart home devices, educational tools |
| COM (e.g., COM Express) | Modular design with processor, memory, and basic I/O; requires carrier board | Medical imaging systems, industrial controllers |
| Industrial SBC | Ruggedized components for harsh environments | Factory automation, outdoor kiosks |
A typical SBC includes a processor (ARM/x86), RAM, flash storage (eMMC/NOR), power management unit, and interfaces (USB, HDMI, GPIO). COMs feature a dense layout with SoC (System on Chip), DDR4 memory packages, thermal dissipation layers, and high-speed connectors. Both utilize PCB substrates with multi-layer routing for signal integrity.
| Parameter | Description | Importance |
|---|---|---|
| CPU Performance | Measured in DMIPS or GHz | Determines processing capability |
| Thermal Design Power (TDP) | Power consumption in watts | Impacts cooling requirements |
| Interface Types | USB 3.0, PCIe, CAN, etc. | Dictates peripheral compatibility |
| Operating Temperature | -40 C to +85 C range | Defines environmental tolerance |
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Raspberry Pi Foundation | Raspberry Pi 4 Model B | Quad-core Cortex-A72, 4K HDMI |
| Intel | COM Express modules | 11th Gen Core processors, PCIe 4.0 |
| NVIDIA | JETSON AGX Xavier | AI accelerator, 32 TOPS performance |
| Advantech | AIMB-236 SBC | Intel Atom x6425E, -20 C to 70 C operation |
Consider processing requirements, power constraints, environmental conditions, and long-term availability. For industrial applications, prioritize extended temperature ranges and RoHS compliance. Evaluate ecosystem support (OS compatibility, SDKs) and choose modular designs for future upgrades.
Key trends include AI integration at the edge, adoption of RISC-V architecture, increased use of heterogeneous computing (CPU+GPU+NPU), and standardization of COM interfaces (e.g., SMARC 2.0). Energy efficiency improvements and cybersecurity features are becoming critical for IoT deployments.