Interface Boards

Image Part Number Description / PDF Quantity Rfq
VCM-DAS-3A

VCM-DAS-3A

VersaLogic Corporation

PC/104,ET, 16 ANALOG, 24 DIGITAL

40

PISO-CAN400U-T

PISO-CAN400U-T

ICP DAS USA Inc.

4 PORT ISOLATED PROTECTION CAN C

30

ASB200-903Q

ASB200-903Q

iBASE Technology

(ASB), CHASSIS WITH IB903F-Q15 B

1

VL-MPEE-A1E

VL-MPEE-A1E

VersaLogic Corporation

MINIPCIE A/D 8X 12-BIT

0

JB-FLOYD-NAO-01

JB-FLOYD-NAO-01

Diamond Systems

JETSON NANO SYSTEM FULL FEATURE

1

VL-EPMS-U1A

VL-EPMS-U1A

VersaLogic Corporation

SUMIT-104, 2 RS232 & 2 GEN PUR.

0

VL-EPMS-U1E

VL-EPMS-U1E

VersaLogic Corporation

2 CHAN SERIAL I/O GPS WITH SUMIT

0

JB-FLD-BASE-01

JB-FLD-BASE-01

Diamond Systems

KIT JETSON NANO/NX CARRIER+ENCL

1

PISO-MN200

PISO-MN200

ICP DAS USA Inc.

PCI BUS, DUAL-LINE MOTIONNET MAS

30

PISO-DNS100-D

PISO-DNS100-D

ICP DAS USA Inc.

1 PORT INTELLIGENT DEVICENET MUL

30

VL-MPEE-E5E

VL-MPEE-E5E

VersaLogic Corporation

DUAL GIGABIT ETHERNET CHANNELS M

79

PISO-CAN200U-D

PISO-CAN200U-D

ICP DAS USA Inc.

2 PORT ISOLATED PROTECTION CAN C

30

IP413-DC

IP413-DC

iBASE Technology

CB, FOR COM EXPRESS (TYPE 6), AL

1

VL-EPM-E2D

VL-EPM-E2D

VersaLogic Corporation

PC/104-PLUS, ET, 10/100, 2 PORT

45

ELT-BB01

ELT-BB01

Diamond Systems

NVIDIA AGX XAVIER BASEBD PCIE104

1

EPS-8100

EPS-8100

Diamond Systems

RUGGED 8-PORT GIGABIT ETHERNET S

1

PISO-MN200T

PISO-MN200T

ICP DAS USA Inc.

PCI BUS, DUAL-LINE MOTIONNET MAS

30

VL-EPM-V7E

VL-EPM-V7E

VersaLogic Corporation

SBC EXPANSION MODULE PC/104+

5

114992124

114992124

Seeed

CORAL M.2 ACCELERATOR B+M KEY

47

VL-EPHS-B1A

VL-EPHS-B1A

VersaLogic Corporation

SUMIT-MICRO, ET, 4 USB

0

Interface Boards

1. Overview

Interface boards for embedded computers are hardware components that facilitate communication between embedded systems and external devices. These boards convert data protocols, manage signal transmission, and ensure compatibility across different hardware architectures. They play a critical role in enabling seamless integration of sensors, actuators, communication modules, and peripheral devices in modern technology, supporting applications from industrial automation to consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Communication Interface BoardsSupport protocols like RS-232, RS-485, CAN, SPI, I2C, and EthernetIndustrial sensors, automotive control units
Digital I/O BoardsProvide programmable input/output channels for binary signalsFactory automation, robotics
Analog I/O BoardsHandle continuous voltage/current signals for precision measurementsMedical equipment, test instruments
Sensor Interface BoardsIntegrate ADC/DAC converters and signal conditioning circuitsEnvironmental monitoring systems
Bus Interface BoardsBridge between embedded systems and standard buses (PCIe, USB, UART)Consumer electronics, aerospace systems

3. Structure and Components

Typical interface boards consist of:

  • PCB substrate with multi-layer routing
  • Connectors (e.g., DB9, RJ45, M12, USB-C)
  • Microcontroller or FPGA for protocol handling
  • Interface-specific chips (e.g., MAX232 for RS-232, CAN transceivers)
  • Power management modules (voltage regulators, isolation circuits)
  • Optional onboard memory (EEPROM, Flash)
  • Thermal management features (heat sinks, thermal vias)

4. Key Technical Specifications

ParameterImportance
Interface TypeDetermines compatibility with connected devices
Data Transfer RateImpacts system response time (up to 10 Gbps in high-speed interfaces)
Operating TemperatureIndustrial (-40 C to +85 C) vs. commercial (0 C to 70 C) ranges
Power ConsumptionCritical for battery-powered embedded systems
Physical DimensionsAffects integration into compact devices
EMI/EMC ComplianceEnsures reliable operation in electrically noisy environments

5. Application Fields

  • Industrial Automation: PLCs, CNC machines, SCADA systems
  • Medical Devices: MRI scanners, patient monitors, diagnostic equipment
  • Automotive: ECU interfaces, ADAS systems, infotainment units
  • Consumer Electronics: Smart home devices, wearable tech
  • Aerospace: Avionics systems, flight control interfaces

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
AdvantechPCM-3680 (Industrial I/O board with multiple interfaces)
National InstrumentsCompactDAQ (Modular data acquisition system)
NXP SemiconductorsKinetis K64F (ARM Cortex-M4 based development board)
TI (Texas Instruments)Tiva C Series TM4C123G (USB-enabled microcontroller board)
SiemensSIMATIC IOT2000 (Industrial IoT gateway with multiple interfaces)

7. Selection Recommendations

Key considerations include:

  • Application Requirements: Match interface types and speeds to system needs (e.g., CAN FD for automotive diagnostics)
  • Environmental Factors: Choose ruggedized boards for vibration/dust-prone environments
  • Future-Proofing: Select boards supporting emerging standards (e.g., PCIe 4.0)
  • Software Support: Verify availability of drivers and SDKs for target OS
  • Cost-Benefit Analysis: Balance performance requirements against budget constraints

8. Industry Trends

  • Miniaturization: Development of sub-10mm interface modules for wearable devices
  • Integration: Combining multiple interface types on single-board computers (SBCs)
  • Wireless Convergence: Growth of Bluetooth/Wi-Fi 6 interface boards
  • AI-Enhanced: Boards with onboard neural processing units (NPUs) for edge computing
  • Industrial 4.0: Time-sensitive networking (TSN) interfaces for real-time automation
  • Green Design: Low-power interfaces compliant with Energy Star standards
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