Accessories

Image Part Number Description / PDF Quantity Rfq
052147

052147

congatec

CABLE INTERFACE FOR LVDS 10POS

1

050055

050055

congatec

SMARC 2.0 PASSIVE COOLING SOLUT

1

045934

045934

congatec

HEATSINK CQM EXPRESS W/HEATPIP

1

048253

048253

congatec

HEATSINK W/ 12V FAN FOR COM EXPR

0

052830

052830

congatec

HEATSINK FOR MINI ITX IA5 12MM F

0

033331

033331

congatec

CABLE INTERFACE FOR LVDS 34POS

1

052652

052652

congatec

I/O SHIELD FOR 1A4 AND 1A5

1

052831

052831

congatec

HEATSINK FOR ATOM IA5 12MM FIN

0

050051

050051

congatec

SMARC 2.0 PASSIVE COOLING SOLUT

1

041655

041655

congatec

HEATSINK W/12V FAN CQM EXPRESS

0

047531

047531

congatec

HEATSINK W/12V FAN CQM EXPRESS

1

016451

016451

congatec

HEATSINK W/12V FAN QSEVEN

0

015535

015535

congatec

CPU BOARD QSEVEN INTEL ATOM

1

048153

048153

congatec

HEATSINK FOR ATOM 12MM FINS

1

048152

048152

congatec

HEATSINK FOR PA5 12MM FINS

1

048556

048556

congatec

HEATSINK FOR COM EXPRESS TCA5

1

045930

045930

congatec

HEATSINK W/12V FAN CQM EXPRESS

1

048554

048554

congatec

HEATSINK FOR COM EXPRESS TCA5

1

050057

050057

congatec

SMARC 2.0 STANDARD HEATSPREADER

0

015531

015531

congatec

PASSIVE COOLING QSEVEN CONGA-QA5

1

Accessories

1. Overview

Embedded computer accessories refer to peripheral components and supporting hardware designed to enhance the functionality, performance, and deployment capabilities of embedded computing systems. These accessories enable customization for specific industrial, commercial, and specialized applications. Their importance stems from their ability to optimize system efficiency, ensure environmental adaptability, and facilitate seamless integration in IoT, automation, and edge computing environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Power Supply ModulesHigh-efficiency DC-DC converters, wide input voltage range, over-current protectionIndustrial automation controllers
Interface Expansion CardsMultifunctional I/O ports (USB, HDMI, CAN), protocol conversion supportSmart transportation systems
Thermal Management ComponentsCompact heat sinks, fanless cooling systems, thermal interface materialsOutdoor surveillance equipment
Mounting & Enclosure KitsVibration-resistant brackets, IP67-rated protective housingsMarine navigation devices
Communication AdaptersWireless modules (Wi-Fi 6, 5G), industrial Ethernet solutionsRemote monitoring terminals

3. Structure and Composition

Typical embedded computer accessories feature: - Reinforced polymer/metal housing for environmental protection - High-density PCB with surface-mount technology (SMT) - Standardized connectors (e.g., M12, Mini PCIe) - Integrated thermal vias and heat dissipation structures - Compliance with industrial standards (RoHS, CE, FCC)

4. Key Technical Specifications

ParameterDescriptionImportance
Operating Temperature-40 C to +85 C industrial gradeEnsures reliability in extreme environments
Power Efficiency 85% conversion rateReduces thermal load and energy costs
Vibration ResistanceIEC 60068-2-6 compliantMaintains stability in mobile applications
EMI/RFI ShieldingFCC Part 15 Class B certificationPrevents signal interference
MTBF 100,000 hoursGuarantees long-term operational continuity

5. Application Areas

  • Industrial Automation: PLC extensions, factory IoT gateways
  • Medical Devices: Portable diagnostic equipment accessories
  • Transportation: In-vehicle computing modules
  • Energy: Smart grid monitoring interfaces
  • Avionics: Ruggedized flight control components

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
AdvantechAIMB-236 interface boardTriple display support, COM port expansion
SiemensSimatic IPC KIT-7100Modular industrial PC accessories
Digi InternationalXBee Pro 6C Wi-Fi moduleIndustrial IoT wireless connectivity
TE ConnectivityDEUTSCH DT 0460 seriesHeavy-duty circular connectors

7. Selection Recommendations

Key considerations:

  1. Environmental compatibility (temperature, humidity, vibration)
  2. Backward compatibility with existing systems
  3. Scalability for future upgrades
  4. Total cost of ownership (TCO) analysis
  5. Compliance with industry-specific certifications

Case Study: A smart city project chose DIN-rail power supplies with 94% efficiency and IP67 enclosures to reduce field maintenance by 40%.

8. Industry Trends

Emerging trends include:

  • Miniaturization driven by 5nm chip integration
  • AI-enabled edge computing accessories
  • Increased adoption of modular, toolless designs
  • Rise of energy-harvesting interface solutions
  • Enhanced cybersecurity features in communication modules
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