Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
CPV363M4U Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 13A 36W IMS-2	0
VS-GT100DA120UF Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 187A 890W SOT227	129
VS-GA200SA60UP Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 200A 500W SOT227	0
CPV362M4U Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 7.2A 23W IMS-2	0
CPV364M4U Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 20A 63W IMS-2	0
CPV363M4K Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 11A 36W IMS-2	0
VS-GT80DA120U Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 139A 658W SOT227	98
VS-ENQ030L120S Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 61A EMIPAK-1B	0
VS-GT140DA60U Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 200A 652W SOT227	0
VS-GT180DA120U Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 281A 1087W SOT227	55
VS-ETF150Y65N Vishay General Semiconductor – Diodes Division	IGBT MOD 650V 201A 600W	8
CPV362M4K Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 5.7A 23W IMS-2	0
VS-ETL015Y120H Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 22A 89W EMIPAK-2B	0
CPV362M4F Vishay General Semiconductor – Diodes Division	IGBT MODULE 600V 8.8A 23W IMS-2	0
VS-ETF075Y60U Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 109A EMIPAK-2B	0
VS-GB15XP120KTPBF Vishay General Semiconductor – Diodes Division	IGBT MODULE 1200V 30A 187W MTP	0
VS-ETY020P120F Vishay General Semiconductor – Diodes Division	IGBT MOD OUTPUT & SW EMIPAK 2B	0
VS-GT300FD060N Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 379A INT-A-PAK	0
VS-GT100TP60N Vishay General Semiconductor – Diodes Division	IGBT MOD 600V 160A INT-A-PAK	0
VS-GT300YH120N Vishay General Semiconductor – Diodes Division	IGBT MOD 1200V 341A INT-A-PAK	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability