Transistors - IGBTs

Transistors - IGBTs - Modules

Part Number	Description / PDF	Quantity
APT75GP120J Roving Networks / Microchip Technology	IGBT MOD 1200V 128A 543W ISOTOP	112
FF1500R12IE5BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 1500A 20MW	2
GSID100A120T2C1A SemiQ	IGBT MOD 1200V 200A 800W	0
FF600R17ME4PBOSA1 IR (Infineon Technologies)	IGBT MODULE VCES 600V 600A	0
FP100R12KT4PB11BPSA1 IR (Infineon Technologies)	IGBT MODULE LOW PWR ECONO3-3	0
MG12450WB-BN2MM Wickmann / Littelfuse	IGBT MODULE 1200V 600A 1950W WB	0
FMG2G75US120	IGBT, 75A, 1200V, N-CHANNEL	45
FZ1600R17KE3NOSA1 IR (Infineon Technologies)	IGBT MOD 1700V 2300A 8950W	4
F3L300R12PT4PB26BOSA1 IR (Infineon Technologies)	IGBT MODULE MED POWER ECONO4-1	0
FMG1G50US60H	IGBT, 50A, 600V, N-CHANNEL	41
APTGT50H60RT3G Roving Networks / Microchip Technology	IGBT MODULE 600V 80A 176W SP3	0
FP35R12W2T4PB11BPSA1 IR (Infineon Technologies)	IGBT MOD 1200V 70A 20MW	34
FP15R12KS4CBOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 30A 180W	0
FS200R12PT4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 280A 1000W	9
FP150R12KT4PB11BPSA1 IR (Infineon Technologies)	FP150R12 - IGBT MODULE	6
FF1000R17IE4BOSA1 IR (Infineon Technologies)	IGBT MODULE 1700V 6250W	2
IXXN100N60B3H1 Wickmann / Littelfuse	IGBT MOD 600V 170A 500W SOT227B	80
FP40R12KT3BOSA1 IR (Infineon Technologies)	FP40R12 - IGBT MODULE	22
A2C35S12M3-F STMicroelectronics	IGBT MOD 1200V 35A 250W ACEPACK2	0
FF900R12IE4BOSA1 IR (Infineon Technologies)	IGBT MOD 1200V 900A 5100W	0

Transistors - IGBTs - Modules

1. Overview

Insulated Gate Bipolar Transistors (IGBTs) modules are hybrid semiconductor devices combining the high input impedance of MOSFETs with the low conduction losses of bipolar transistors. They serve as critical components in high-power switching applications, enabling efficient energy conversion in industrial, automotive, and consumer systems. Their ability to handle high voltage/current with fast switching characteristics makes them indispensable in modern power electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Standard IGBT Modules	General-purpose, balanced conduction/switching losses	Industrial motor drives, HVAC systems
High-Speed IGBTs	Optimized for switching frequencies >20kHz	Welding inverters, induction heating
Enhanced Dynamic IGBTs	Reduced tail current for lower switching losses	Electric vehicle (EV) on-board chargers
Trench IGBTs	Vertical trench gate structure for improved efficiency	Solar inverters, energy storage systems
Double-Sided Cooling Modules	Thermal management with cooling on both sides	High-power traction systems, wind turbines

3. Structure and Composition

IGBT modules typically consist of multiple IGBT dies and freewheeling diodes mounted on a ceramic substrate (usually Al₂O₃ or Si₃N₄). Key structural elements include:

Chip-level integration of IGBT and diode cells
DBC (Direct Bonded Copper) substrate for thermal conductivity
Thermoplastic/epoxy encapsulation for insulation
Aluminum wire bonds for die interconnection
Integrated temperature sensors in advanced modules

4. Key Technical Specifications

Parameter	Description	Importance
Rated Collector Current (I_C)	Maximum continuous operating current	Determines power handling capability
Breakdown Voltage (V_CE)	Max voltage before conduction	System voltage rating compatibility
Conduction Voltage Drop	Voltage loss during on-state	Impacts efficiency and thermal design
Switching Losses (E_on/E_off)	Energy loss during state transitions	Dictates maximum switching frequency
Operating Temperature Range	Valid junction temperature range	Reliability and lifespan factor
Isolation Voltage	Dielectric strength between layers	Safety compliance for high-voltage systems

5. Application Areas

Industrial: Motor drives, CNC machines, welding equipment
Automotive: EV traction inverters, PHEV battery management
Energy: Solar PV inverters, wind turbine converters
Consumer: High-end home appliances with variable speed drives
Rail: Traction systems for high-speed trains and metro networks

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Infineon	FF600R12KE4	600A/1200V, 3-level topology, 175 C rating
ON Semiconductor	NVHL015AN	150A/1200V, automotive qualified
Mitsubishi Electric	CM400DY-34A	400A/1700V, double-sided cooling
Fuji Electric	2MBI150XAA120-50	150A/1200V, intelligent power module
STMicroelectronics	STGF8NC60KD	8A/600V, through-hole package

7. Selection Guidelines

Key considerations include:

Matching voltage/current ratings with system requirements
Switching frequency vs. conduction loss trade-off
Thermal management capabilities (R_th values)
Short-circuit withstand capability
Package dimensions and cooling interface compatibility
Functional safety requirements (e.g., ISO 26262 for automotive)

8. Industry Trends

Emerging trends include:

Transition to SiC/GaN hybrid modules for higher efficiency
Development of 3D packaging for reduced parasitic inductance
Integration of gate drivers and sensors in smart modules
Growing adoption in EV charging infrastructure (800V+ systems)
Advancements in sintering technology for die attach reliability