Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
PHP23NQ11T,127 Nexperia	MOSFET N-CH 110V 23A TO220AB	10570
BUK7626-100B,118 Nexperia	MOSFET N-CH 100V 49A D2PAK	5023
PSMN034-100PS,127 Nexperia	MOSFET N-CH 100V 32A TO220AB	575
BSS84AKW,115 Nexperia	MOSFET P-CH 50V 150MA SOT323	20935
BUK765R2-40B,118 Nexperia	MOSFET N-CH 40V 75A D2PAK	3258
PMN30UNX Nexperia	MOSFET N-CH 30V 4.5A 6TSOP	6778
BUK7608-55A,118 Nexperia	MOSFET N-CH 55V 75A D2PAK	397
PSMN022-30BL,118 Nexperia	MOSFET N-CH 30V 30A D2PAK	3131
PMV60ENEAR Nexperia	MOSFET N-CH 40V 3A TO236AB	2623
BUK9Y8R7-60E,115 Nexperia	MOSFET N-CH 60V 86A LFPAK56	63
PSMN3R4-30PL,127 Nexperia	MOSFET N-CH 30V 100A TO220AB	512
PMN120ENEAX Nexperia	MOSFET N-CH 60V 2.5A 6TSOP	5950
BUK9217-75B,118 Nexperia	MOSFET N-CH 75V 64A DPAK	186
PSMN1R5-40PS,127 Nexperia	MOSFET N-CH 40V 120A TO220AB	4831
PMZB290UNE2YL Nexperia	MOSFET N-CH 20V 1.2A DFN1006B-3	0
BUK6Y33-60PX Nexperia	MOSFET P-CH 60V 30A LFPAK56	2977
PMXB65UPEZ Nexperia	MOSFET P-CH 12V 3.2A DFN1010D-3	0
PMXB350UPEZ Nexperia	MOSFET P-CH 20V 1.2A DFN1010D-3	4
BUK7M20-40HX Nexperia	MOSFET N-CH 40V 25A LFPAK33	0
PMPB20ENZ Nexperia	MOSFET N-CH 30V 7.2A DFN2020MD-6	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS