Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
VN10KN3-G-P014

VN10KN3-G-P014

Roving Networks / Microchip Technology

MOSFET N-CH 60V 310MA TO92-3

0

MSC035SMA070B

MSC035SMA070B

Roving Networks / Microchip Technology

MOSFET N-CH 700V TO247

5

APT5010JVRU2

APT5010JVRU2

Roving Networks / Microchip Technology

MOSFET N-CH 500V 44A SOT227

4

APT1201R6SVFRG

APT1201R6SVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 1200V 8A D3PAK

0

DN2535N3-G

DN2535N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 350V 120MA TO92

1104

APT6015LVFRG

APT6015LVFRG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 38A TO264

0

APT50M50JVFR

APT50M50JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 500V 77A ISOTOP

0

APT7F100B

APT7F100B

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 7A TO247

0

TN0620N3-G-P014

TN0620N3-G-P014

Roving Networks / Microchip Technology

MOSFET N-CH 200V 250MA TO92-3

0

APT20M20JFLL

APT20M20JFLL

Roving Networks / Microchip Technology

MOSFET N-CH 200V 104A ISOTOP

0

APT10078BLLG

APT10078BLLG

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 14A TO247

0

APT6010B2LLG

APT6010B2LLG

Roving Networks / Microchip Technology

MOSFET N-CH 600V 54A T-MAX

0

APT30F50S

APT30F50S

Roving Networks / Microchip Technology

MOSFET N-CH 500V 30A D3PAK

0

VN2210N3-G

VN2210N3-G

Roving Networks / Microchip Technology

MOSFET N-CH 100V 1.2A TO92-3

1000

APT20M11JVR

APT20M11JVR

Roving Networks / Microchip Technology

MOSFET N-CH 200V 175A ISOTOP

0

APT10025JVFR

APT10025JVFR

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 34A ISOTOP

0

APT37F50S

APT37F50S

Roving Networks / Microchip Technology

MOSFET N-CH 500V 37A D3PAK

0

APT25M100J

APT25M100J

Roving Networks / Microchip Technology

MOSFET N-CH 1000V 25A ISOTOP

0

APT20M45SVRG

APT20M45SVRG

Roving Networks / Microchip Technology

MOSFET N-CH 200V 56A D3PAK

0

2N6661

2N6661

Roving Networks / Microchip Technology

MOSFET N-CH 90V 350MA TO39

2191

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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