Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
CXDM1002N TR PBFREE

CXDM1002N TR PBFREE

Central Semiconductor

MOSFET N-CH 100V 2A SOT-89

2148

CDM4-600LR TR13 PBFREE

CDM4-600LR TR13 PBFREE

Central Semiconductor

MOSFET N-CH 600V 4A DPAK

2218

CWDM3011P TR13 PBFREE

CWDM3011P TR13 PBFREE

Central Semiconductor

MOSFET P-CH 30V 11A 8SOIC

2500

2N7002 TR PBFREE

2N7002 TR PBFREE

Central Semiconductor

MOSFET N-CH 60V 115MA SOT23

40290

CDM2205-800FP SL

CDM2205-800FP SL

Central Semiconductor

MOSFET N-CH 800V 5A TO220FP

1

CDM7-600LR TR13 PBFREE

CDM7-600LR TR13 PBFREE

Central Semiconductor

MOSFET N-CH 600V 7A DPAK

2368

CMPDM202PH TR

CMPDM202PH TR

Central Semiconductor

MOSFET P-CH 20V 2.3A SOT-23F

0

CTLDM7590 TR

CTLDM7590 TR

Central Semiconductor

MOSFET P-CH 20V 140MA TLM3D6D8

0

CMPDM302PH TR

CMPDM302PH TR

Central Semiconductor

MOSFET P-CH 30V 2.4A SOT-23F

0

CEDM8004 BK PBFREE

CEDM8004 BK PBFREE

Central Semiconductor

MOSFET P-CH 30V 450MA SOT883

0

2N7002 BK PBFREE

2N7002 BK PBFREE

Central Semiconductor

MOSFET N-CH 60V 115MA SOT23

0

CTLDM3590 TR

CTLDM3590 TR

Central Semiconductor

MOSFET N-CH 20V 160MA TLM3D6D8

0

CDM3-800 TR13 PBFREE

CDM3-800 TR13 PBFREE

Central Semiconductor

MOSFET N-CH 800V 3A DPAK

2441

CMLDM8120 TR

CMLDM8120 TR

Central Semiconductor

MOSFET P-CH 20V 860MA SOT563

876

CDM22011-600LRFP SL

CDM22011-600LRFP SL

Central Semiconductor

MOSFET N-CH 600V 11A TO220FP

590

CEDM7002AE TR PBFREE

CEDM7002AE TR PBFREE

Central Semiconductor

MOSFET N-CH 60V 300MA SOT883L

2147483647

CEDM8001 BK PBFREE

CEDM8001 BK PBFREE

Central Semiconductor

MOSFET P-CH 20V 100MA SOT883

0

CEDM8001 TR PBFREE

CEDM8001 TR PBFREE

Central Semiconductor

MOSFET P-CH 20V 100MA SOT883

2776000

CMPDM303NH TR

CMPDM303NH TR

Central Semiconductor

MOSFET N-CH 30V 3.6A SOT-23F

0

CMPDM7003 TR PBFREE

CMPDM7003 TR PBFREE

Central Semiconductor

MOSFET N-CH 50V 280MA SOT23

2806

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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