Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SIHP6N40D-GE3

SIHP6N40D-GE3

Vishay / Siliconix

MOSFET N-CH 400V 6A TO220AB

904

SI7454DP-T1-E3

SI7454DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 100V 5A PPAK SO-8

38546

SI3459BDV-T1-GE3

SI3459BDV-T1-GE3

Vishay / Siliconix

MOSFET P-CH 60V 2.9A 6TSOP

14833

SI4431BDY-T1-GE3

SI4431BDY-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 5.7A 8SO

0

SUP90P06-09L-E3

SUP90P06-09L-E3

Vishay / Siliconix

MOSFET P-CH 60V 90A TO220AB

523

IRFS11N50ATRLP

IRFS11N50ATRLP

Vishay / Siliconix

MOSFET N-CH 500V 11A TO263AB

551

SQJ431AEP-T1_GE3

SQJ431AEP-T1_GE3

Vishay / Siliconix

MOSFET P-CH 200V 9.4A PPAK SO-8

4971

SIA432DJ-T1-GE3

SIA432DJ-T1-GE3

Vishay / Siliconix

MOSFET N-CH 30V 12A PPAK SC70-6

815

IRF9530PBF-BE3

IRF9530PBF-BE3

Vishay / Siliconix

MOSFET P-CH 100V 12A TO220AB

986

IRF640SPBF

IRF640SPBF

Vishay / Siliconix

MOSFET N-CH 200V 18A D2PAK

674

IRFR120TRPBF-BE3

IRFR120TRPBF-BE3

Vishay / Siliconix

MOSFET N-CH 100V 7.7A DPAK

1900

SI4430BDY-T1-E3

SI4430BDY-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 14A 8SO

3

SI7370DP-T1-E3

SI7370DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 60V 9.6A PPAK SO-8

0

SIR632DP-T1-RE3

SIR632DP-T1-RE3

Vishay / Siliconix

MOSFET N-CH 150V 29A PPAK SO-8

3560

IRFBC30ASTRLPBF

IRFBC30ASTRLPBF

Vishay / Siliconix

MOSFET N-CH 600V 3.6A D2PAK

790

SI7390DP-T1-E3

SI7390DP-T1-E3

Vishay / Siliconix

MOSFET N-CH 30V 9A PPAK SO-8

0

SI7415DN-T1-GE3

SI7415DN-T1-GE3

Vishay / Siliconix

MOSFET P-CH 60V 3.6A PPAK1212-8

0

IRLZ14SPBF

IRLZ14SPBF

Vishay / Siliconix

MOSFET N-CH 60V 10A D2PAK

1569

SI7149DP-T1-GE3

SI7149DP-T1-GE3

Vishay / Siliconix

MOSFET P-CH 30V 50A PPAK SO-8

5641

SIHA120N60E-GE3

SIHA120N60E-GE3

Vishay / Siliconix

MOSFET N-CH 600V 25A TO220

18

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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