Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
TK13A45D(STA4,Q,M)

TK13A45D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 450V 13A TO220SIS

0

SSM3J334R,LF

SSM3J334R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET P-CH 30V 4A SOT23F

6610

TK17N65W,S1F

TK17N65W,S1F

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 17.3A TO247

30

TK10A60W,S4X

TK10A60W,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 600V 9.7A TO220

0

TK5A45DA(STA4,Q,M)

TK5A45DA(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 450V 4.5A TO220SIS

0

TPH2900ENH,L1Q

TPH2900ENH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 200V 33A 8SOP

1064

TK31N60W,S1VF

TK31N60W,S1VF

Toshiba Electronic Devices and Storage Corporation

MOSFET N CH 600V 30.8A TO247

48

SSM6K513NU,LF

SSM6K513NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 15A 6UDFNB

202

TPH1R306PL,L1Q

TPH1R306PL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 100A 8SOP

353

TPH3R70APL,L1Q

TPH3R70APL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 90A 8SOP

0

SSM3K361R,LF

SSM3K361R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 100V 3.5A SOT-23F

33858

SSM6K504NU,LF

SSM6K504NU,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 9A 6UDFNB

2637

SSM3K16CT(TPL3)

SSM3K16CT(TPL3)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 20V 100MA CST3

0

SSM3K336R,LF

SSM3K336R,LF

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 3A SOT23F

0

TPN7R506NH,L1Q

TPN7R506NH,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 26A 8TSON

0

TK14E65W5,S1X

TK14E65W5,S1X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 13.7A TO220

210

TK9P65W,RQ

TK9P65W,RQ

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 650V 9.3A DPAK

0

TK12A50D(STA4,Q,M)

TK12A50D(STA4,Q,M)

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 500V 12A TO220SIS

0

TK58A06N1,S4X

TK58A06N1,S4X

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 60V 58A TO220SIS

20

TPWR8503NL,L1Q

TPWR8503NL,L1Q

Toshiba Electronic Devices and Storage Corporation

MOSFET N-CH 30V 150A 8DSOP

309

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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