Transistors - FETs, MOSFETs

Transistors - FETs, MOSFETs - Single

Part Number	Description / PDF	Quantity
STW43N60DM2 STMicroelectronics	MOSFET N-CH 600V 34A TO247	259
STP26N60M2 STMicroelectronics	MOSFET N-CHANNEL 600V 20A TO220	0
STF7N60M2 STMicroelectronics	MOSFET N-CH 600V 5A TO220FP	829
STD20NF06LAG STMicroelectronics	MOSFET N-CHANNEL 60V 24A DPAK	1324
SCTW35N65G2VAG STMicroelectronics	SICFET N-CH 650V 45A HIP247	492
STF2N80K5 STMicroelectronics	MOSFET N-CH 800V 2A TO220FP	1045
STP2NK90Z STMicroelectronics	MOSFET N-CH 900V 2.1A TO220AB	1822
STU7NM60N STMicroelectronics	MOSFET N-CH 600V 5A IPAK	4082
STFI13N60M2 STMicroelectronics	MOSFET N-CH 600V 11A I2PAKFP	0
STB34N65M5 STMicroelectronics	MOSFET N-CH 650V 28A D2PAK	411
SCTWA90N65G2V-4 STMicroelectronics	TRANS SJT N-CH 650V 119A HIP247	63
STO67N60DM6 STMicroelectronics	MOSFET N-CH 600V 33A TOLL	1830
STD4N90K5 STMicroelectronics	MOSFET N-CH 900V 3A DPAK	2373
STP22NM60N STMicroelectronics	MOSFET N-CH 600V 16A TO220AB	949
STL24N65M2 STMicroelectronics	MOSFET N-CH 650V 14A PWRFLAT HV	0
STW72N60DM2AG STMicroelectronics	MOSFET N-CH 600V 66A TO247	1297
STF12N50DM2 STMicroelectronics	MOSFET N-CH 500V 11A TO220FP	901
STH175N4F6-6AG STMicroelectronics	MOSFET N-CH 40V 120A H2PAK-2	0
STH6N95K5-2 STMicroelectronics	MOSFET N-CH 950V 6A H2PAK-2	239
STP3NK60Z STMicroelectronics	MOSFET N-CH 600V 2.4A TO220AB	0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Junction FET (JFET)	Voltage-controlled depletion mode operation, low noise	Low-noise amplifiers, analog switches
Enhancement Mode MOSFET	Normally-off device, requires positive V_GS to conduct	Power supplies, motor drives
Depletion Mode MOSFET	Normally-on device, requires negative V_GS to block	Radio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)	Combines MOSFET input with bipolar output, high current capacity	High-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO₂), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

Parameter	Description and Importance
V_DS (Drain-Source Voltage)	Maximum voltage rating between drain and source; determines breakdown tolerance
I_D (Drain Current)	Maximum continuous current capacity; critical for power handling
R_DS(on)	On-state resistance; impacts conduction losses and efficiency
V_GS(th) (Threshold Voltage)	Voltage required to form channel; determines control signal compatibility
Q_G (Gate Charge)	Charge required for switching; affects switching speed and driver requirements
P_D (Power Dissipation)	Maximum power handling capability; dictates thermal management needs

5. Application Fields

Consumer Electronics: Mobile phone chargers, notebook power adapters
Industrial: Motor drives, uninterruptible power supplies (UPS)
Automotive: Electric vehicle (EV) battery management systems, HEV inverters
Telecommunications: Base station power amplifiers, optical network transceivers
Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Texas Instruments	CSD18534Q5A	60V, 4.2m R_DS(on), automotive-grade
STMicroelectronics	STP55NF06	55A, 60V, high-speed switching
Infineon Technologies	IPB041N06N3	0.41 , 600V, TO-220 package
ON Semiconductor	NDS355AN	Depletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

Voltage and current requirements under operating conditions
Thermal performance (R_DS(on), package thermal resistance)
Switching speed vs. conduction loss trade-off
Gate drive compatibility with control circuitry
Environmental factors (temperature, vibration, humidity)
Cost-performance balance for volume production

8. Industry Trends

Current trends include:

Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
Advanced packaging technologies (double-sided cooling, copper clip)
Integration with gate drivers and protection circuits
Miniaturization through trench and shielded gate structures
Development of automotive-qualified devices for EVs and ADAS