Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
SKI07074

SKI07074

Sanken Electric Co., Ltd.

MOSFET N-CH 75V 85A TO263

0

2SK3801

2SK3801

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 70A TO3P

0

DKI10299

DKI10299

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 28A TO252

0

EKI10126

EKI10126

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 66A TO220-3

0

FKI10126

FKI10126

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 41A TO220F

0

DKI04077

DKI04077

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 47A TO252

0

GKI10194

GKI10194

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 7A 8DFN

0

DKI06108

DKI06108

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 47A TO252

12

GKI03039

GKI03039

Sanken Electric Co., Ltd.

MOSFET N-CH 30V 18A 8DFN

50

FKI06108

FKI06108

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 39A TO220F

0

GKI04076

GKI04076

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 11A 8DFN

25

2SK2803

2SK2803

Sanken Electric Co., Ltd.

MOSFET N-CH 450V 3A TO220F

0

GKI07301

GKI07301

Sanken Electric Co., Ltd.

MOSFET N-CH 75V 6A 8DFN

388

EKI10198

EKI10198

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 47A TO220-3

0

FKP300A

FKP300A

Sanken Electric Co., Ltd.

MOSFET N-CH 300V 30A TO3PF

0

SKI04024

SKI04024

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 85A TO263

0

GKI04031

GKI04031

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 17A 8DFN

5

2SK2943

2SK2943

Sanken Electric Co., Ltd.

MOSFET N-CH 900V 3A TO220F

0

2SK3199

2SK3199

Sanken Electric Co., Ltd.

MOSFET N-CH 500V 5A TO220F

0

DKI03038

DKI03038

Sanken Electric Co., Ltd.

MOSFET N-CH 30V 48A TO252

27

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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