Transistors - FETs, MOSFETs - Single

Image Part Number Description / PDF Quantity Rfq
FKI06190

FKI06190

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 30A TO220F

0

EKI04027

EKI04027

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 85A TO220-3

0

FKI10198

FKI10198

Sanken Electric Co., Ltd.

MOSFET N-CH 100V 31A TO220F

0

EKI06075

EKI06075

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 78A TO220-3

0

SKI03063

SKI03063

Sanken Electric Co., Ltd.

MOSFET N-CH 30V 40A TO263

0

FKV575

FKV575

Sanken Electric Co., Ltd.

MOSFET N-CH 50V 75A TO220

3502

2SK2420

2SK2420

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 30A TO220F

0

FKP202

FKP202

Sanken Electric Co., Ltd.

MOSFET N-CH 200V 45A TO220

0

2SK3800

2SK3800

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 70A TO220S

0

GKI07174

GKI07174

Sanken Electric Co., Ltd.

MOSFET N-CH 75V 7A/26A 8DFN

0

DKI06186

DKI06186

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 31A TO252

0

2SK3710

2SK3710

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 85A TO220S

0

FKP330C

FKP330C

Sanken Electric Co., Ltd.

MOSFET N-CH 330V 30A TO3P

0

SKP253

SKP253

Sanken Electric Co., Ltd.

MOSFET N-CH 250V 20A TO263-3

0

GKI06071

GKI06071

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 11A 8DFN

0

SKI06048

SKI06048

Sanken Electric Co., Ltd.

MOSFET N-CH 60V 85A TO263

0

2SK3003

2SK3003

Sanken Electric Co., Ltd.

MOSFET N-CH 200V 18A TO220F

0

SKI04044

SKI04044

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 80A TO263

38

EKI04036

EKI04036

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 80A TO220-3

0

DKI04046

DKI04046

Sanken Electric Co., Ltd.

MOSFET N-CH 40V 48A TO252

0

Transistors - FETs, MOSFETs - Single

1. Overview

Field-Effect Transistors (FETs) and Metal-Oxide-Semiconductor FETs (MOSFETs) are voltage-controlled semiconductor devices that regulate current flow through an electric field. As fundamental components in modern electronics, they offer advantages such as high input impedance, low power consumption, and fast switching capabilities. Single discrete FETs/MOSFETs are widely used in power management, signal amplification, and switching applications across industries.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Junction FET (JFET)Voltage-controlled depletion mode operation, low noiseLow-noise amplifiers, analog switches
Enhancement Mode MOSFETNormally-off device, requires positive VGS to conductPower supplies, motor drives
Depletion Mode MOSFETNormally-on device, requires negative VGS to blockRadio frequency amplifiers, load switches
Insulated Gate Bipolar Transistor (IGBT)Combines MOSFET input with bipolar output, high current capacityHigh-power industrial equipment, electric vehicles

3. Structure and Composition

A typical MOSFET structure includes three terminals: Source, Gate, and Drain. The gate is insulated by a thin layer of silicon dioxide (SiO2), forming a capacitive control interface. The channel between source and drain is formed in a silicon substrate. Advanced devices use materials like silicon carbide (SiC) or gallium nitride (GaN) for higher performance. Packaging options include TO-220, DPAK, and SOT-23 for different thermal and space requirements.

4. Key Technical Specifications

ParameterDescription and Importance
VDS (Drain-Source Voltage)Maximum voltage rating between drain and source; determines breakdown tolerance
ID (Drain Current)Maximum continuous current capacity; critical for power handling
RDS(on)On-state resistance; impacts conduction losses and efficiency
VGS(th) (Threshold Voltage)Voltage required to form channel; determines control signal compatibility
QG (Gate Charge)Charge required for switching; affects switching speed and driver requirements
PD (Power Dissipation)Maximum power handling capability; dictates thermal management needs

5. Application Fields

  • Consumer Electronics: Mobile phone chargers, notebook power adapters
  • Industrial: Motor drives, uninterruptible power supplies (UPS)
  • Automotive: Electric vehicle (EV) battery management systems, HEV inverters
  • Telecommunications: Base station power amplifiers, optical network transceivers
  • Renewable Energy: Solar micro-inverters, wind turbine converters

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsCSD18534Q5A60V, 4.2m RDS(on), automotive-grade
STMicroelectronicsSTP55NF0655A, 60V, high-speed switching
Infineon TechnologiesIPB041N06N30.41 , 600V, TO-220 package
ON SemiconductorNDS355ANDepletion mode, 300mA, RF applications

7. Selection Guidelines

Key considerations include:

  • Voltage and current requirements under operating conditions
  • Thermal performance (RDS(on), package thermal resistance)
  • Switching speed vs. conduction loss trade-off
  • Gate drive compatibility with control circuitry
  • Environmental factors (temperature, vibration, humidity)
  • Cost-performance balance for volume production

8. Industry Trends

Current trends include:

  • Adoption of wide bandgap materials (SiC, GaN) for higher efficiency
  • Advanced packaging technologies (double-sided cooling, copper clip)
  • Integration with gate drivers and protection circuits
  • Miniaturization through trench and shielded gate structures
  • Development of automotive-qualified devices for EVs and ADAS

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