Transistors - FETs, MOSFETs - RF

Image Part Number Description / PDF Quantity Rfq
MRF7S38010HSR5

MRF7S38010HSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 65V 3.6GHZ NI-400S

20

AFT26HW050GSR3

AFT26HW050GSR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF N CHANNEL, MOSFET

0

MRF9002NR2

MRF9002NR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF ULTRA HIGH FREQUENCY BAND, N-

0

MRF6S24140HSR5

MRF6S24140HSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

TRANSISTOR

47

AFV09P350-04GNR3

AFV09P350-04GNR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF POWER FIELD-EFFECT TRANSISTOR

253

MRF6S21050LSR5

MRF6S21050LSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 68V 2.16GHZ NI-400S

0

MRF18030ALSR5

MRF18030ALSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 65V 1.88GHZ NI-400S

50

MRF6P9220HR5

MRF6P9220HR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 68V 880MHZ NI-860C3

50

MRF8P20160HSR3

MRF8P20160HSR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, L BAND, N-CHANNEL

2952

MRF8S19260HSR6

MRF8S19260HSR6

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, L BAND, N-CHANNEL

40

MHT1004GNR3

MHT1004GNR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF POWER FIELD-EFFECT TRANSISTOR

46

MRF8P23160WHSR3

MRF8P23160WHSR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF S BAND, N-CHANNEL

0

MRFE6P9220HR3

MRFE6P9220HR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, ULTRA HIGH FREQUE

866

MRF6V14300HS

MRF6V14300HS

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 100V 1.4GHZ NI780S

64

MRF6P9220HR3

MRF6P9220HR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, ULTRA HIGH FREQUE

230

MRF8S21200HR6

MRF8S21200HR6

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, S BAND, N-CHANNEL

360

MRF6VP121KHR5-FR

MRF6VP121KHR5-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF 2-ELEMENT, L BAND, N-CHANNEL

130

A2T26H160-24SR3

A2T26H160-24SR3

Freescale Semiconductor, Inc. (NXP Semiconductors)

RF POWER FIELD-EFFECT TRANSISTOR

202

MRF8P18265HSR5

MRF8P18265HSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWER, N-CHANNEL, MOSFET

30

MRF5S21100HSR5

MRF5S21100HSR5

Freescale Semiconductor, Inc. (NXP Semiconductors)

FET RF 65V 2.17GHZ NI-780S

50

Transistors - FETs, MOSFETs - RF

1. Overview

RF FETs and MOSFETs are critical semiconductor devices designed for high-frequency signal amplification and switching in radio frequency (RF) applications. These transistors operate efficiently in microwave and RF circuits, enabling wireless communication, radar systems, and broadcasting equipment. Their ability to handle high frequencies (typically above 1 MHz) with minimal noise and distortion makes them indispensable in modern telecommunications infrastructure.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Junction FET (JFET)Voltage-controlled device with low noise and high input impedanceLow-noise amplifiers in RF receivers
MESFETMetal-Semiconductor FET with GaAs substrate for high-speed operationSatellite communication systems
HEMT/PHEMTHigh-electron-mobility transistor with pseudomorphic structures5G base stations, microwave amplifiers
LDMOSLateral Diffused MOSFET with high power density and thermal stabilityCellular base station amplifiers
GaN HEMTGallium Nitride-based HEMT for ultra-high frequency/powerRadar systems, 5G mmWave

3. Structure and Composition

RF FETs typically feature a three-terminal structure (source, gate, drain) with a semiconductor channel (Si, GaAs, or GaN). The gate region uses Schottky contacts (MESFET) or insulated layers (MOSFET). Advanced devices like HEMTs employ heterojunctions between different semiconductor materials (e.g., AlGaN/GaN) to enhance electron mobility. Packaging includes ceramic or plastic enclosures with RF-compatible connectors to minimize parasitic capacitance and inductance.

4. Key Technical Specifications

ParameterDescriptionImportance
Frequency RangeOperational bandwidth (e.g., 0.1-6 GHz)Determines application suitability
Power Output (P1dB)1dB compression point (e.g., 10-500W)Measures linearity and saturation
Gain (S21)Signal amplification ratio (e.g., 10-30 dB)System sensitivity indicator
Efficiency (PAE)Power-added efficiency (e.g., 40-75%)Energy consumption metric
Input/Output VSWRVoltage Standing Wave Ratio (e.g., <2:1)Mismatch loss assessment

5. Application Fields

  • Telecommunications: 5G/4G base stations, small cells, fiber-optic networks
  • Defense: Radar systems, electronic warfare, UAV communication
  • Broadcasting: FM/TV transmitters, satellite uplinks
  • Medical: MRI machines, RF ablation equipment
  • Industrial: Plasma generators, RFID readers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Specifications
NXP SemiconductorsMRF1K50GN50W GaN HEMT, 1.8-2.7GHz, 70% PAE
Wolfspeed (Cree)CGH4G090400F400W GaN HEMT, 900MHz, 10:1 VSWR ruggedness
InfineonBLS14H10LS-250250W LDMOS, 1.8-2.2GHz, 14dB gain
MACOMNPT1007SiGe HBT, 7GHz, 18dB gain for 5G

7. Selection Recommendations

  1. Match operating frequency to device transition frequency (fT)
  2. Verify power handling with derating curves under working temperatures
  3. Assess package thermal resistance (Rth) for longevity
  4. Compare S-parameters for impedance matching requirements
  5. Consider ESD protection and ruggedness for field conditions

8. Industry Trends

Key trends include: - Wide bandgap materials (GaN/SiC) enabling higher efficiency (>80%) at mmWave frequencies - 3D packaging for reduced parasitics in 5G massive MIMO systems - Integrated RF frontend modules (FEM) with on-chip matching networks - AI-driven design optimization for complex impedance matching - Growing adoption of GaN-on-diamond substrates for thermal management

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