| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
NXP Semiconductors |
FET RF 6V 400MHZ 6TSSOP |
3000 |
|
 |
NXP Semiconductors |
N-CHANNEL POWER MOSFET |
2900 |
|
 |
Renesas Electronics America |
SMALL SIGNAL FET |
30000 |
|
 |
Ampleon |
RF FET LDMOS 104V 22DB 12VDFN |
0 |
|
 |
Ampleon |
RF FET LDMOS 75V 16DB SOT538A |
0 |
|
 |
Ampleon |
RF FET LDMOS 110V 28DB SOT1214A |
4 |
|
 |
IR (Infineon Technologies) |
BTS132 - N-CHANNEL TEMPFET |
23500 |
|
 |
Ampleon |
RF FET LDMOS 65V 20.6DB SOT1242B |
69 |
|
 |
Ampleon |
RF FET LDMOS 65V 14.5DB SOT12521 |
0 |
|
 |
PCH 4V DRIVE SERIES |
60000 |
|
|
 |
STMicroelectronics |
TRANSISTOR RF MOSFET N-CH M174 |
0 |
|
 |
Ampleon |
RF TRANSISTOR |
172 |
|
 |
SMALL SIGNAL FET |
2438 |
|
|
 |
NCH+SBD 4V DRIVE SERIES |
9000 |
|
|
 |
Ampleon |
BLC2425M10LS250/SOT1273/TRAYDP |
147 |
|
 |
STMicroelectronics |
TRANS RF N-CH FET POWERSO-10RF |
0 |
|
 |
Roving Networks / Microchip Technology |
RF FET N CH 1000V 13A TO264 |
7 |
|
 |
Wolfspeed - a Cree company |
RF MOSFET HEMT 50V 440117 |
50 |
|
 |
Freescale Semiconductor, Inc. (NXP Semiconductors) |
POWER, N-CHANNEL, MOSFET |
3 |
|
 |
SMT LOW NOISE AMPLIFIER, 45 - 60 |
0 |
|
RF FETs and MOSFETs are critical semiconductor devices designed for high-frequency signal amplification and switching in radio frequency (RF) applications. These transistors operate efficiently in microwave and RF circuits, enabling wireless communication, radar systems, and broadcasting equipment. Their ability to handle high frequencies (typically above 1 MHz) with minimal noise and distortion makes them indispensable in modern telecommunications infrastructure.
| Type | Functional Features | Application Examples |
|---|---|---|
| Junction FET (JFET) | Voltage-controlled device with low noise and high input impedance | Low-noise amplifiers in RF receivers |
| MESFET | Metal-Semiconductor FET with GaAs substrate for high-speed operation | Satellite communication systems |
| HEMT/PHEMT | High-electron-mobility transistor with pseudomorphic structures | 5G base stations, microwave amplifiers |
| LDMOS | Lateral Diffused MOSFET with high power density and thermal stability | Cellular base station amplifiers |
| GaN HEMT | Gallium Nitride-based HEMT for ultra-high frequency/power | Radar systems, 5G mmWave |
RF FETs typically feature a three-terminal structure (source, gate, drain) with a semiconductor channel (Si, GaAs, or GaN). The gate region uses Schottky contacts (MESFET) or insulated layers (MOSFET). Advanced devices like HEMTs employ heterojunctions between different semiconductor materials (e.g., AlGaN/GaN) to enhance electron mobility. Packaging includes ceramic or plastic enclosures with RF-compatible connectors to minimize parasitic capacitance and inductance.
| Parameter | Description | Importance |
|---|---|---|
| Frequency Range | Operational bandwidth (e.g., 0.1-6 GHz) | Determines application suitability |
| Power Output (P1dB) | 1dB compression point (e.g., 10-500W) | Measures linearity and saturation |
| Gain (S21) | Signal amplification ratio (e.g., 10-30 dB) | System sensitivity indicator |
| Efficiency (PAE) | Power-added efficiency (e.g., 40-75%) | Energy consumption metric |
| Input/Output VSWR | Voltage Standing Wave Ratio (e.g., <2:1) | Mismatch loss assessment |
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| NXP Semiconductors | MRF1K50GN | 50W GaN HEMT, 1.8-2.7GHz, 70% PAE |
| Wolfspeed (Cree) | CGH4G090400F | 400W GaN HEMT, 900MHz, 10:1 VSWR ruggedness |
| Infineon | BLS14H10LS-250 | 250W LDMOS, 1.8-2.2GHz, 14dB gain |
| MACOM | NPT1007 | SiGe HBT, 7GHz, 18dB gain for 5G |
Key trends include: - Wide bandgap materials (GaN/SiC) enabling higher efficiency (>80%) at mmWave frequencies - 3D packaging for reduced parasitics in 5G massive MIMO systems - Integrated RF frontend modules (FEM) with on-chip matching networks - AI-driven design optimization for complex impedance matching - Growing adoption of GaN-on-diamond substrates for thermal management