Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
TN2219A TIN/LEAD

TN2219A TIN/LEAD

Central Semiconductor

TRANSISTOR-SMALL SIGNAL

0

2N2907 PBFREE

2N2907 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N2368 PBFREE

2N2368 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N5963 PBFREE

2N5963 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

82500

BCX23 PBFREE

BCX23 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N4058 PBFREE

2N4058 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

BCY59-VIII PBFREE

BCY59-VIII PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N6714 TIN/LEAD

2N6714 TIN/LEAD

Central Semiconductor

TRANSISTOR-BIPOLAR POWER

0

2N3725A PBFREE

2N3725A PBFREE

Central Semiconductor

TRANS NPN 50V 1.2A TO-39

0

2N3439 PBFREE

2N3439 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N1131 PBFREE

2N1131 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

2N3725 TIN/LEAD

2N3725 TIN/LEAD

Central Semiconductor

TRANS NPN 50V 1.2A TO-39

0

BCX38A PBFREE

BCX38A PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

BSY79 PBFREE

BSY79 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

BCX22 PBFREE

BCX22 PBFREE

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

SE9402

SE9402

Central Semiconductor

TRANS PNP BIPOLAR TO220

0

CMPT5401E TR

CMPT5401E TR

Central Semiconductor

TRANS PNP

0

CTLT953-M833S TR

CTLT953-M833S TR

Central Semiconductor

SMT TRANS BIPOLAR PWR

0

CTLT853-M833S BK

CTLT853-M833S BK

Central Semiconductor

SMT TRANS BIPOLAR PWR

0

2N5192R

2N5192R

Central Semiconductor

TRANS NPN 80V 4A TO126

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
RFQ BOM Call Skype Email
Top