Transistors - Bipolar (BJT) - Single

Image Part Number Description / PDF Quantity Rfq
CP591X-2N2907A-CT

CP591X-2N2907A-CT

Central Semiconductor

TRANS PNP AMP SWITCH CHIP 1=400

0

CP736V-2N5401-CT

CP736V-2N5401-CT

Central Semiconductor

TRANS PNP 150V 600MA CHIP 1=400

0

2N4036 W/GOLD

2N4036 W/GOLD

Central Semiconductor

TRANS PNP 65V 1A TO-39

0

2N4410 TIN/LEAD

2N4410 TIN/LEAD

Central Semiconductor

TRANS NPN 80V 0.25A TO-92

0

CP336V-2N5551-CT20

CP336V-2N5551-CT20

Central Semiconductor

TRANS NPN 1=20PCS

0

2N3701

2N3701

Central Semiconductor

THROUGH-HOLE TRANSISTOR-SMALL SI

0

TIP136

TIP136

Central Semiconductor

TRANS PNP DARL 80V 8A TO-220AB

0

TIP130

TIP130

Central Semiconductor

TRANS NPN DARL 60V 8A TO-220AB

0

CTLT853-M833S TR

CTLT853-M833S TR

Central Semiconductor

SMT TRANS BIPOLAR PWR

0

SE9301

SE9301

Central Semiconductor

TRANS NPN BIPOLAR TO220

0

SE9401

SE9401

Central Semiconductor

TRANS PNP BIPOLAR TO220

0

CJD13003 TR13

CJD13003 TR13

Central Semiconductor

TRANS NPN 700V 1.5A DPAK

0

SE9302

SE9302

Central Semiconductor

TRANS NPN BIPOLAR TO220

0

CP127-2N6301-CT

CP127-2N6301-CT

Central Semiconductor

TRANS NPN DARL 80V 8A CHIP 1=200

0

TIP49 SL

TIP49 SL

Central Semiconductor

TRANS NPN 350V 1A TO220

0

CTLT953-M833S BK

CTLT953-M833S BK

Central Semiconductor

SMT TRANS BIPOLAR PWR

0

CMPT5551E BK

CMPT5551E BK

Central Semiconductor

TRANS PNP

0

BCX56 TR

BCX56 TR

Central Semiconductor

TRANSISTOR NPN SOT89

0

CP247-MJ11016-WN

CP247-MJ11016-WN

Central Semiconductor

IC TRANSISTOR

0

CXT5401E BK

CXT5401E BK

Central Semiconductor

TRANS PNP

0

Transistors - Bipolar (BJT) - Single

1. Overview

Bipolar Junction Transistors (BJTs) are three-terminal semiconductor devices that use both electron and hole charge carriers. They form the foundation of analog electronics through their ability to amplify signals and control current flow. BJTs remain critical in modern electronics for applications ranging from audio amplifiers to power management circuits, offering superior linearity and robustness in switching operations.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
NPN TransistorMajority carriers: electrons. Requires positive base current for conduction.Low-noise amplifiers, digital logic circuits
PNP TransistorMajority carriers: holes. Conducts with negative base current.Power supply circuits, motor controllers
High-Frequency BJTOptimized for RF/microwave signal amplification (fT > 100 MHz)Wireless communication systems, radar
Power BJTHigh current/voltage ratings (IC > 1A, VCE > 50V)Switch-mode power supplies, motor drives

3. Structure & Composition

BJTs consist of three doped semiconductor regions forming two p-n junctions:

  • Emitter: Heavily doped region emitting charge carriers
  • Base: Thin, lightly doped middle region controlling carrier flow
  • Collector: Moderately doped region collecting carriers

Manufactured using silicon (common) or germanium (historic) with planar processing technology. The structure forms either NPN (n-type emitter/base/collector) or PNP configuration, with metal contacts for external connections.

4. Key Technical Specifications

ParameterDescriptionImportance
Current Gain (hFE)Ratio of collector to base current (10-1000)Determines amplification capability
Transition Frequency (fT)Frequency at which current gain drops to 1Limits high-frequency performance
Max Collector Current (ICmax)Maximum allowable continuous collector currentDefines power handling capability
Breakdown Voltage (VCEO)Max voltage between collector and emitterPrevents device failure under stress
Saturation Voltage (VCEsat)Voltage drop in fully conducting stateAffects power efficiency in switching

5. Application Areas

  • Consumer Electronics: Audio amplifiers, LED drivers
  • Automotive: Engine control units, electric vehicle inverters
  • Industrial: PLCs, motor controllers
  • Telecommunications: RF power amplifiers, fiber optic transceivers
  • Aerospace: Avionics systems, satellite transponders

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey SpecificationsTypical Use
ON Semiconductor2N3904hFE: 100-300, fT: 300 MHzGeneral-purpose switching
InfineonBC547VCEO: 50V, ICmax: 100mAAnalog signal amplification
STMicroelectronics2SD2656ICmax: 15A, VCEO: 80VPower inverter applications
Diodes Inc.BFR93AfT: 10 GHz, Noise Figure: 2dBHigh-frequency front-end amplifiers

7. Selection Guidelines

  • Determine operating frequency: Select fT > 3 target frequency
  • Power requirements: Ensure Icmax and VCEO exceed circuit requirements by 20%
  • Thermal considerations: Calculate power dissipation (P=VCE IC)
  • Package type: TO-92 for low power, TO-220 for high-power applications
  • Environmental factors: Consider temperature ratings for industrial/military use

8. Industry Trends

Future developments include:

  • High-frequency BJTs operating beyond 100 GHz for 6G communication
  • Integrated BJT-MOSFET hybrid devices (BiCMOS) for mixed-signal applications
  • Wide-bandgap materials (SiC/GaN) for higher power density
  • Miniaturization through chip-scale packaging
  • Improved thermal management solutions for automotive applications
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