Thyristors - DIACs, SIDACs

Image Part Number Description / PDF Quantity Rfq
K2400EH70

K2400EH70

Wickmann / Littelfuse

SIDAC 220-250V 1A TO92

8000

K2200GHRP

K2200GHRP

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K2400GHURP

K2400GHURP

Wickmann / Littelfuse

SIDAC 220-250V 1A DO15

0

K1300GURP

K1300GURP

Wickmann / Littelfuse

SIDAC 120-138V 1A UNI DO-15

0

K1100SRP

K1100SRP

Wickmann / Littelfuse

SIDAC 104-118V 1A DO214

0

K2400SRP

K2400SRP

Wickmann / Littelfuse

SIDAC 220-250V 1A DO214

0

K2200GAP

K2200GAP

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K2500GHU

K2500GHU

Wickmann / Littelfuse

SIDAC 240-280V 1A DO15

0

K2200GHURP

K2200GHURP

Wickmann / Littelfuse

SIDAC 205-230V 1A DO15

0

K2200GURP

K2200GURP

Wickmann / Littelfuse

SIDAC UNI 210-230V 1A DO-15

0

K1050GRP

K1050GRP

Wickmann / Littelfuse

SIDAC 95-113V 1A DO15

0

K1400SRP

K1400SRP

Wickmann / Littelfuse

SIDAC 130-146V 1A DO214

0

K2501GLRP

K2501GLRP

Wickmann / Littelfuse

SIDAC MP 240-265V H.V. DO15 TR

0

K2200EH70

K2200EH70

Wickmann / Littelfuse

SIDAC 205-230V 1A TO92

0

MKP3V120RLG

MKP3V120RLG

Wickmann / Littelfuse

SIDAC, 130V MAX

2563

K0900GRP

K0900GRP

Wickmann / Littelfuse

SIDAC 79-97V 1A DO15

0

K2000E70RP2

K2000E70RP2

Wickmann / Littelfuse

SIDAC 190-215V 1A TO92

0

K1100G

K1100G

Wickmann / Littelfuse

SIDAC 104-118V 1A DO15

0

K3601GRP

K3601GRP

Wickmann / Littelfuse

SIDAC 340-380V 1A DO15

0

K1050GURP

K1050GURP

Wickmann / Littelfuse

SIDAC 95-110V 1A UNI DO-15

0

Thyristors - DIACs, SIDACs

1. Overview

DIACs (Diodes for Alternating Current) and SIDACs (Silicon Diodes for Alternating Current) are bidirectional trigger devices used primarily to control thyristor-based circuits. These three-layer semiconductor devices exhibit negative resistance characteristics and are critical in AC power control systems. They enable precise switching of high-voltage AC loads through their unique breakover voltage behavior, making them essential in lighting, motor control, and industrial automation applications.

2. Main Types and Functional Classification

Type Functionality Application Examples
DIAC Low-power bidirectional trigger diode with symmetrical breakover voltage TRIAC gate triggering in dimmer switches
SIDAC Higher current/voltage capability with precise voltage clamping Industrial motor speed controllers
Programmable DIAC Voltage-adjustable triggering through external resistors Customizable power control systems

3. Structure and Composition

DIACs/SIDACs typically consist of a four-layer (PNPN) silicon structure with two main terminals (A1/A2). The symmetrical doping profile creates a negative resistance region during reverse bias. Advanced devices incorporate:

  • Epitaxial silicon layers for precise voltage control
  • Passivation layers for voltage stability
  • Metallization patterns for thermal management
  • Plastic/ceramic packaging for environmental protection

4. Key Technical Specifications

Parameter Description Importance
Breakover Voltage (VBO) Voltage threshold for conduction (typically 20-32V) Determines triggering point
Trigger Current (IT) Minimum current to sustain conduction Impacts load compatibility
Holding Current (IH) Current level to maintain on-state Affects circuit stability
Peak Current (IPT) Maximum transient current capability Overload protection
dv/dt Voltage change rate immunity Prevents false triggering

5. Application Areas

Key industries and equipment:

  • Lighting: Smart dimming systems, LED drivers
  • Industrial: Conveyor belt controllers, heating systems
  • Consumer: Washing machine motor controls
  • Power Electronics: AC voltage regulators

Example: DIACs in phase-control dimmers trigger TRIACs at specific AC cycle points to adjust light intensity.

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
STMicroelectronics DB3 Standard DIAC with 32V VBO
ON Semiconductor SIDAC103 100V, 3A industrial SIDAC
Vishay TECC94 High surge current capability

7. Selection Guidelines

Key considerations:

  1. Match VBO to TRIAC gate requirements
  2. Verify current ratings with load characteristics
  3. Choose packaging based on thermal needs
  4. Consider dv/dt ratings for noisy environments
  5. Evaluate temperature stability for industrial applications

8. Industry Trends

Emerging developments:

  • Integration with wide-bandgap semiconductors (SiC/GaN)
  • Miniaturization for PCB space optimization
  • Improved dv/dt immunity for EV charging systems
  • Smart grid compatibility with IoT-enabled controllers

Market growth driven by energy-efficient lighting and industrial automation demands.

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