Thyristors - DIACs, SIDACs

Image Part Number Description / PDF Quantity Rfq
K1500E70

K1500E70

Wickmann / Littelfuse

SIDAC 140-170V 1A TO92

1049

MKP3V240G

MKP3V240G

Wickmann / Littelfuse

SIDAC, 250V MAX

2805

K2200EH70RP2

K2200EH70RP2

Wickmann / Littelfuse

SIDAC 205-230V 1A TO92

0

K2300GURP

K2300GURP

Wickmann / Littelfuse

SIDAC UNI 220-240V 1A DO-15

0

K2500E70RP2

K2500E70RP2

Wickmann / Littelfuse

SIDAC 240-280V 1A TO92

0

K1300G

K1300G

Wickmann / Littelfuse

SIDAC 120-138V 1A DO15

457

K1300S1URP

K1300S1URP

Wickmann / Littelfuse

SIDAC 120-138V 1A UNI DO-214AC

0

MKP1V240G

MKP1V240G

Wickmann / Littelfuse

SIDAC 220-250V 900MA AXIAL

0

K1050S1URP

K1050S1URP

Wickmann / Littelfuse

SIDAC 95-110V 1A UNI DO-214AC

0

K2400GAP

K2400GAP

Wickmann / Littelfuse

SIDAC 220-250V 1A DO15

0

K2200E70RP3

K2200E70RP3

Wickmann / Littelfuse

SIDAC 205-230V 1A TO92

0

K2500S1URP

K2500S1URP

Wickmann / Littelfuse

SIDAC UNI 240-260V 1A DO214AC

0

K1800SRP

K1800SRP

Wickmann / Littelfuse

SIDAC 165-195V 1A DO214

0

K1100GRP

K1100GRP

Wickmann / Littelfuse

SIDAC 104-118V 1A DO15

0

K1500G

K1500G

Wickmann / Littelfuse

SIDAC 140-170V 1A DO15

160

K2500GURP

K2500GURP

Wickmann / Littelfuse

SIDAC UNI 240-260V 1A DO-15

0

K2500GRP

K2500GRP

Wickmann / Littelfuse

SIDAC 240-280V 1A DO15

0

MKP1V160G

MKP1V160G

Wickmann / Littelfuse

SIDAC 150-170V 900MA AXIAL

0

K2400GRP

K2400GRP

Wickmann / Littelfuse

SIDAC 220-250V 1A DO15

12130

K2200SRP

K2200SRP

Wickmann / Littelfuse

SIDAC 205-230V 1A DO214

0

Thyristors - DIACs, SIDACs

1. Overview

DIACs (Diodes for Alternating Current) and SIDACs (Silicon Diodes for Alternating Current) are bidirectional trigger devices used primarily to control thyristor-based circuits. These three-layer semiconductor devices exhibit negative resistance characteristics and are critical in AC power control systems. They enable precise switching of high-voltage AC loads through their unique breakover voltage behavior, making them essential in lighting, motor control, and industrial automation applications.

2. Main Types and Functional Classification

Type Functionality Application Examples
DIAC Low-power bidirectional trigger diode with symmetrical breakover voltage TRIAC gate triggering in dimmer switches
SIDAC Higher current/voltage capability with precise voltage clamping Industrial motor speed controllers
Programmable DIAC Voltage-adjustable triggering through external resistors Customizable power control systems

3. Structure and Composition

DIACs/SIDACs typically consist of a four-layer (PNPN) silicon structure with two main terminals (A1/A2). The symmetrical doping profile creates a negative resistance region during reverse bias. Advanced devices incorporate:

  • Epitaxial silicon layers for precise voltage control
  • Passivation layers for voltage stability
  • Metallization patterns for thermal management
  • Plastic/ceramic packaging for environmental protection

4. Key Technical Specifications

Parameter Description Importance
Breakover Voltage (VBO) Voltage threshold for conduction (typically 20-32V) Determines triggering point
Trigger Current (IT) Minimum current to sustain conduction Impacts load compatibility
Holding Current (IH) Current level to maintain on-state Affects circuit stability
Peak Current (IPT) Maximum transient current capability Overload protection
dv/dt Voltage change rate immunity Prevents false triggering

5. Application Areas

Key industries and equipment:

  • Lighting: Smart dimming systems, LED drivers
  • Industrial: Conveyor belt controllers, heating systems
  • Consumer: Washing machine motor controls
  • Power Electronics: AC voltage regulators

Example: DIACs in phase-control dimmers trigger TRIACs at specific AC cycle points to adjust light intensity.

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
STMicroelectronics DB3 Standard DIAC with 32V VBO
ON Semiconductor SIDAC103 100V, 3A industrial SIDAC
Vishay TECC94 High surge current capability

7. Selection Guidelines

Key considerations:

  1. Match VBO to TRIAC gate requirements
  2. Verify current ratings with load characteristics
  3. Choose packaging based on thermal needs
  4. Consider dv/dt ratings for noisy environments
  5. Evaluate temperature stability for industrial applications

8. Industry Trends

Emerging developments:

  • Integration with wide-bandgap semiconductors (SiC/GaN)
  • Miniaturization for PCB space optimization
  • Improved dv/dt immunity for EV charging systems
  • Smart grid compatibility with IoT-enabled controllers

Market growth driven by energy-efficient lighting and industrial automation demands.

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