Thyristors - DIACs, SIDACs

Image Part Number Description / PDF Quantity Rfq
D32PBULK

D32PBULK

EIC Semiconductor, Inc.

DIAC 1.6A, CASE TYPE: DO-41

1673

K1050E70AP

K1050E70AP

Wickmann / Littelfuse

SIDAC 95-113V 1A TO92

0

K1100E70AP

K1100E70AP

Wickmann / Littelfuse

SIDAC 104-118V 1A TO92

0

D32BULK

D32BULK

EIC Semiconductor, Inc.

DIAC 1.6A, CASE TYPE: M1A

5211

K2300GRP

K2300GRP

Wickmann / Littelfuse

SIDAC 230V DO15

0

K2300SRP

K2300SRP

Wickmann / Littelfuse

SIDAC 230V DO214 2L

0

N413-AZ

N413-AZ

Renesas Electronics America

DIAC TRIGGER DIODE

0

K2300G

K2300G

Wickmann / Littelfuse

SIDAC 230V DO15

0

SMT10001T3

SMT10001T3

THY SMB SPECIAL SURGE

0

N413-T1-AZ

N413-T1-AZ

Renesas Electronics America

DIAC TRIGGER DIODE

822000

K1800S1URP

K1800S1URP

Wickmann / Littelfuse

SIDAC 180V DO214AC 2L

0

K2300GAP

K2300GAP

Wickmann / Littelfuse

SIDAC 230V DO15

0

K0900E70AP

K0900E70AP

Wickmann / Littelfuse

SIDAC 79-97V 1A TO92

0

LIC01-215H

LIC01-215H

STMicroelectronics

IC LIGHT IGNITION CIRCUIT I-PAK

0

HT36B

HT36B

Wickmann / Littelfuse

DIAC 34-38V 2A DO35

0

HT32BRP

HT32BRP

Wickmann / Littelfuse

DIAC 30-34V 2A DO35

0

K2500S

K2500S

Wickmann / Littelfuse

SIDAC 240-280V 1A DO214

0

HT32RP

HT32RP

Wickmann / Littelfuse

DIAC 27-37V 2A DO35

0

HT36BRP

HT36BRP

Wickmann / Littelfuse

DIAC 34-38V 2A DO35

0

DB3-TP

DB3-TP

Micro Commercial Components (MCC)

DIAC 28-36V 2A DO35

0

Thyristors - DIACs, SIDACs

1. Overview

DIACs (Diodes for Alternating Current) and SIDACs (Silicon Diodes for Alternating Current) are bidirectional trigger devices used primarily to control thyristor-based circuits. These three-layer semiconductor devices exhibit negative resistance characteristics and are critical in AC power control systems. They enable precise switching of high-voltage AC loads through their unique breakover voltage behavior, making them essential in lighting, motor control, and industrial automation applications.

2. Main Types and Functional Classification

Type Functionality Application Examples
DIAC Low-power bidirectional trigger diode with symmetrical breakover voltage TRIAC gate triggering in dimmer switches
SIDAC Higher current/voltage capability with precise voltage clamping Industrial motor speed controllers
Programmable DIAC Voltage-adjustable triggering through external resistors Customizable power control systems

3. Structure and Composition

DIACs/SIDACs typically consist of a four-layer (PNPN) silicon structure with two main terminals (A1/A2). The symmetrical doping profile creates a negative resistance region during reverse bias. Advanced devices incorporate:

  • Epitaxial silicon layers for precise voltage control
  • Passivation layers for voltage stability
  • Metallization patterns for thermal management
  • Plastic/ceramic packaging for environmental protection

4. Key Technical Specifications

Parameter Description Importance
Breakover Voltage (VBO) Voltage threshold for conduction (typically 20-32V) Determines triggering point
Trigger Current (IT) Minimum current to sustain conduction Impacts load compatibility
Holding Current (IH) Current level to maintain on-state Affects circuit stability
Peak Current (IPT) Maximum transient current capability Overload protection
dv/dt Voltage change rate immunity Prevents false triggering

5. Application Areas

Key industries and equipment:

  • Lighting: Smart dimming systems, LED drivers
  • Industrial: Conveyor belt controllers, heating systems
  • Consumer: Washing machine motor controls
  • Power Electronics: AC voltage regulators

Example: DIACs in phase-control dimmers trigger TRIACs at specific AC cycle points to adjust light intensity.

6. Leading Manufacturers and Products

Manufacturer Product Series Key Features
STMicroelectronics DB3 Standard DIAC with 32V VBO
ON Semiconductor SIDAC103 100V, 3A industrial SIDAC
Vishay TECC94 High surge current capability

7. Selection Guidelines

Key considerations:

  1. Match VBO to TRIAC gate requirements
  2. Verify current ratings with load characteristics
  3. Choose packaging based on thermal needs
  4. Consider dv/dt ratings for noisy environments
  5. Evaluate temperature stability for industrial applications

8. Industry Trends

Emerging developments:

  • Integration with wide-bandgap semiconductors (SiC/GaN)
  • Miniaturization for PCB space optimization
  • Improved dv/dt immunity for EV charging systems
  • Smart grid compatibility with IoT-enabled controllers

Market growth driven by energy-efficient lighting and industrial automation demands.

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