Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
MAX86171DEMBD#

MAX86171DEMBD#

Maxim Integrated

EVALUATION KIT

0

MAX1668EVSYS

MAX1668EVSYS

Maxim Integrated

EVALUATION SYSTEM MAX1668

0

MAX44006EVKIT#

MAX44006EVKIT#

Maxim Integrated

KIT EVAL FOR MAX44006

0

MAXCAM10640EVKIT#

MAXCAM10640EVKIT#

Maxim Integrated

EVKIT FOR 5/12V OV10640/MAX927X

0

MAX1441EVSYS+

MAX1441EVSYS+

Maxim Integrated

EVAL SYSTEM FOR MAX1441

0

MAX6654EVSYS

MAX6654EVSYS

Maxim Integrated

EVAL KIT MAX6654 TEMP SENSOR

0

MAX44005EVKIT+

MAX44005EVKIT+

Maxim Integrated

KIT PROXIMITY SENSOR

0

MAX44009PMB1#

MAX44009PMB1#

Maxim Integrated

KIT FOR MAX44009

0

MAXCAMOV10640#

MAXCAMOV10640#

Maxim Integrated

MAX9271 BASED CAMERA WITH OV1064

0

MAX44009EVKIT+

MAX44009EVKIT+

Maxim Integrated

EVAL KIT MAX44009

0

MAX86100EVSYS#

MAX86100EVSYS#

Maxim Integrated

EVAL KIT FOR MAX86100

0

MAX6660EVSYS

MAX6660EVSYS

Maxim Integrated

EVAL KIT FOR MAX6660

0

MAXREFDES26#

MAXREFDES26#

Maxim Integrated

SENSOR BOARD FOR MAXREFDES23#

0

MAX86000EVSYS#

MAX86000EVSYS#

Maxim Integrated

EVAL KIT FOR PULSE OXIMETER

0

MAX44004EVSYS#

MAX44004EVSYS#

Maxim Integrated

EVALUATION FOR MAX44004GDT

0

MAX6640EVCMOD2

MAX6640EVCMOD2

Maxim Integrated

EVAL SYSTEM/EVAL KIT MAX6640 (2-

0

MAX6695EVKIT

MAX6695EVKIT

Maxim Integrated

EVAL KIT/SYSTEM MAX6695 (DUAL RE

0

MAX9635EVKIT

MAX9635EVKIT

Maxim Integrated

KIT EVAL FOR MAX9635

0

MAX6683EVKIT

MAX6683EVKIT

Maxim Integrated

EVAL KIT FOR MAX6683

0

MAX86907BEVSYS#

MAX86907BEVSYS#

Maxim Integrated

EVALUATION KIT MAX86907

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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