Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
MAXREFDES82#

MAXREFDES82#

Maxim Integrated

SMART FORCE SENSOR BOARD

19

MAX31730UEVKIT#

MAX31730UEVKIT#

Maxim Integrated

KIT EVAL 3-REMOTE TEMP SENSOR

936

MAXREFDES100#

MAXREFDES100#

Maxim Integrated

EVKIT HEALTH SENSOR PLATFORM

3

MAX31889EVSYS#

MAX31889EVSYS#

Maxim Integrated

(MAX31889EVKIT+MAX32630FTHR) 0.2

348

MAXREFDES174#

MAXREFDES174#

Maxim Integrated

IO-LINK DISTANCE SENSOR

10

MAX1617AEVKIT

MAX1617AEVKIT

Maxim Integrated

EVAL KIT MAX1617A (REMOTE/LOCAL

7

MAX7500EVKIT+

MAX7500EVKIT+

Maxim Integrated

KIT EVAL FOR MAX7500

10

MAX6675EVKIT

MAX6675EVKIT

Maxim Integrated

EVAL KIT FOR MAX6675

7

MAX31730TEVKIT#

MAX31730TEVKIT#

Maxim Integrated

KIT EVAL 3-REMOTE TEMP SENSOR

0

MAXREFDES163#

MAXREFDES163#

Maxim Integrated

ULTRA-TINY BINARY MAGNETIC SENSO

38

MAX86171EVSYS#

MAX86171EVSYS#

Maxim Integrated

EVALUATION KIT SENSOR

54

MAX6662EVKIT+

MAX6662EVKIT+

Maxim Integrated

EVALUATION KIT FOR MAX6662

6

MAX6660EVKIT

MAX6660EVKIT

Maxim Integrated

EVAL KIT FOR MAX6660

10

MAX6635EVKIT+

MAX6635EVKIT+

Maxim Integrated

EVALUATION KIT FOR MAX6635

7

MAX6639EVKIT+

MAX6639EVKIT+

Maxim Integrated

EVALUATION KIT FOR MAX6639/F

16

MAXREFDES171#

MAXREFDES171#

Maxim Integrated

IO-LINK DISTANCE SENSOR

13

MAX6642EVKIT

MAX6642EVKIT

Maxim Integrated

EVAL KIT/SYSTEM MAX6642 (A+/-1AC

11

MAXREFDES173#

MAXREFDES173#

Maxim Integrated

IO-LINK LOCAL TEMPERATURE SENSOR

13

MAX6654EVKIT

MAX6654EVKIT

Maxim Integrated

EVAL KIT FOR MAX6654

8

MAXWSNENV#

MAXWSNENV#

Maxim Integrated

DEMO KIT FOR WSN

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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