Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
EV_ICM-20600

EV_ICM-20600

TDK InvenSense

EVAL BOARD

0

EV_IIM-42352

EV_IIM-42352

TDK InvenSense

EVAL BOARD FOR IIM-42352

49

DK-10110

DK-10110

TDK InvenSense

DEVLEOPMENT KIT FOR ICP-10110

2

EV_ICG-20330

EV_ICG-20330

TDK InvenSense

EVAL BOARD

0

EV_MPU-6500

EV_MPU-6500

TDK InvenSense

EVAL BOARD

0

EV_ICM-20608-G

EV_ICM-20608-G

TDK InvenSense

EVAL BOARD

0

EV_ICG-20660L

EV_ICG-20660L

TDK InvenSense

EVAL BOARD

0

MPU-9150EVB

MPU-9150EVB

TDK InvenSense

BOARD EVAL FOR MPU-9150

0

MPU-9250 CA-SDK

MPU-9250 CA-SDK

TDK InvenSense

KIT DEV MPU-9250 9-AXIS

0

EV_MPU-9250

EV_MPU-9250

TDK InvenSense

EVAL BOARD FOR MPU-9250

0

BRD_CARRIER

BRD_CARRIER

TDK InvenSense

MOTION SENSOR EVAL BOARD

0

STUDIO-30630-EVB

STUDIO-30630-EVB

TDK InvenSense

FIREFLY DEV KIT ICM-30630

0

EV_MPU-3050

EV_MPU-3050

TDK InvenSense

BOARD EVAL FOR MPU-3050

0

EV_ITG-3521

EV_ITG-3521

TDK InvenSense

EVALUATION BOARD ITG-3521

0

EV_ICM-10340

EV_ICM-10340

TDK InvenSense

EVALUATION OF ICM-10340

0

EV_ICM-10320

EV_ICM-10320

TDK InvenSense

EVALUATION OF ICM-10320

0

EV_ITG-3520

EV_ITG-3520

TDK InvenSense

EVALUATION BOARD ITG-3520

0

EV_ICM-20680

EV_ICM-20680

TDK InvenSense

EVALUATION OF ICM-20680

0

EV_IXZ-2020

EV_IXZ-2020

TDK InvenSense

EVALUATION BOARD IXZ-2020

0

EV_ICM-20631

EV_ICM-20631

TDK InvenSense

EVALUATION OF ICM-20631

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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