Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
DK-20602

DK-20602

TDK InvenSense

DEVELOPMENT BOARD FOR ICM-20602

11

EV_ITG-1010

EV_ITG-1010

TDK InvenSense

EVAL BOARD

0

EV_ICM-20609

EV_ICM-20609

TDK InvenSense

EVAL BOARD

0

EV_IDG-2030U

EV_IDG-2030U

TDK InvenSense

EVAL BOARD

0

DK-10111

DK-10111

TDK InvenSense

DEVELOPMENT KIT FOR ICP-10111

5

EV_MPU-6515

EV_MPU-6515

TDK InvenSense

EVAL BOARD

0

DK-10101

DK-10101

TDK InvenSense

DEVLEOPMENT KIT FOR ICP-10101

4

EV_IAM-20680

EV_IAM-20680

TDK InvenSense

EVAL BOARD

0

EV_ITG-3701

EV_ITG-3701

TDK InvenSense

EVAL BOARD

0

EV_ICM-20649

EV_ICM-20649

TDK InvenSense

EVAL BOARD

0

DK-10125

DK-10125

TDK InvenSense

ICP-10125 DEVELOPMENT BOARD

0

EV_ISZ-2510

EV_ISZ-2510

TDK InvenSense

EVAL BOARD

0

EV_IIM-42351

EV_IIM-42351

TDK InvenSense

EVAL BOARD FOR IIM-42351

49

DK-42351

DK-42351

TDK InvenSense

IIM-42352 DEVELOPMENT KIT

22

EV_IIM-42652

EV_IIM-42652

TDK InvenSense

EVAL BOARD FOR IIM-42652

44

DK-42352

DK-42352

TDK InvenSense

IIM-42352 DEVELOPMENT KIT

21

EV_IXZ-2510

EV_IXZ-2510

TDK InvenSense

EVAL BOARD

0

DK-42652

DK-42652

TDK InvenSense

IIM-42652 DEVELOPMENT KIT

49

EV_MOD_CH101-01-02

EV_MOD_CH101-01-02

TDK InvenSense

CHIRP EVALUATION MODULE CH101

0

EV_ICG-1020S

EV_ICG-1020S

TDK InvenSense

EVAL BOARD

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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