Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
FRDM-FXS-MULT2-B

FRDM-FXS-MULT2-B

NXP Semiconductors

BLUETOOTH DEV PLATFORM

2

MICROFC-SMTPA-30035-GEVB

MICROFC-SMTPA-30035-GEVB

Sanyo Semiconductor/ON Semiconductor

C-SERIES 3MM 35U SMTPA

3

AS5050-DK-ST

AS5050-DK-ST

ams

BOARD DEMO FOR AS5050

0

SEN0002

SEN0002

DFRobot

URM04 V2.0 ULTRASONIC SENSOR

1

0273.600.033

0273.600.033

Bosch Connected Devices and Solutions

XDK110 NODE 10PACK W/O GATEWAY

0

EVAL-ADPD2140Z

EVAL-ADPD2140Z

Analog Devices, Inc.

EVALUATION BOARD

3

STEVAL-MKI194V1

STEVAL-MKI194V1

STMicroelectronics

LSM6DSR ADAPTER BOARD FOR A STAN

26

ROB-09454

ROB-09454

SparkFun

LINE SENSOR BREAKOUT-QRE1113

812

VL53L1-SATEL

VL53L1-SATEL

STMicroelectronics

BREAKOUT BOARDS BASED ON THE VL5

38

MTI-20-2A5G4-DK

MTI-20-2A5G4-DK

Xsens

KIT VRU RS232/USB 5G 450DEG/S

0

AS5510-SO_EK_AB

AS5510-SO_EK_AB

ams

ADAPTER BOARD FOR AS5510

19

HMC6343-EVAL

HMC6343-EVAL

Honeywell Aerospace

EVAL BOARD FOR HMC6343

0

CY8CKIT-148

CY8CKIT-148

Cypress Semiconductor

INDUCTIVE SENSING EVALUATION

11

ATBNO055-XPRO

ATBNO055-XPRO

Roving Networks / Microchip Technology

BNO055 XPLAINED PRO EVAL KIT

31

SEN0097

SEN0097

DFRobot

LIGHT SENSOR-BH1750

16

STEVAL-MKI164V1

STEVAL-MKI164V1

STMicroelectronics

ADAPTER BOARD LIS2HH12 DIL24

46

SCC2230-E02-PCB

SCC2230-E02-PCB

TOKO / Murata

SENSOR HARDWARE & ACCESSORIES ME

0

ASEK758ECB-200B-T-DK

ASEK758ECB-200B-T-DK

Allegro MicroSystems

BOARD DEMO 758ECB-200B SENSOR

3

FRONTPANEL2EK

FRONTPANEL2EK

Silicon Labs

BOARD EVAL PROXIMITY F8XX SI1120

1

DVK91205

DVK91205

Melexis

BOARD EVAL FOR MLX91205

2

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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