Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
UNIVERSAL DEMO KIT WITH USB CONNECTION & CABLE

UNIVERSAL DEMO KIT WITH USB CONNECTION & CABLE

Excelitas Technologies

DEMO KIT DIGIPYRO SENSORS TO USB

110

EVM430-FR6047

EVM430-FR6047

Texas Instruments

EVAL MODULE MSP430FR6047

19

54-00016

54-00016

Interlink Electronics

4-ZONE MOUSING HDK

4

TSL2740-EVM

TSL2740-EVM

ams

EVAL BOARD FOR TSL2740

2

HDC2022EVM

HDC2022EVM

Texas Instruments

HDC2022 TEMPERATURE AND HUMIDITY

11

STEVAL-MKI207V1

STEVAL-MKI207V1

STMicroelectronics

ISM330DHCX ADAPTER BOARD FOR A S

0

ADIS16209/PCBZ

ADIS16209/PCBZ

Analog Devices, Inc.

BOARD EVAL FOR ADIS16209

55

DK-57VTS-LPC1788

DK-57VTS-LPC1788

Future Designs, Inc.

KIT DEV LPC1788 5.7 VGA TOUCH

1

968-022

968-022

Spec Sensors

968-021 SDK-H2S SENSOR DEVELOPER

0

4243

4243

Pololu Corporation

QTR-MD-03A REF ARRAY 3CHNL

75

968-050

968-050

Spec Sensors

SDK-O3 SENSOR DEVELOPER KIT

10

TMP461EVM

TMP461EVM

Texas Instruments

EVAL MODULE TMP461

2

SEN-09269

SEN-09269

SparkFun

ADXL335 3AXIS ACCELEROMETER 3G

39

LTFEVM

LTFEVM

ams

EVAL MODULE

4

AS6200-WL_DK_ST

AS6200-WL_DK_ST

ams

DEMO BOARD FOR AS6200

2

AS5013-QF_EK_AB

AS5013-QF_EK_AB

ams

AS5013 ADAPTER BOARD

12

MAX31875EVKIT#

MAX31875EVKIT#

Maxim Integrated

EVAL TEMP SENSOR MAX31875

111

STEVAL-MET001V1

STEVAL-MET001V1

STMicroelectronics

EVAL BOARD FOR LPS22HB

0

EVBMCR1101-05-5

EVBMCR1101-05-5

Aceinna Inc.

EVAL BOARD FOR MCR1101-05-5

0

TMPSNSRD-RTD2

TMPSNSRD-RTD2

Roving Networks / Microchip Technology

BOARD RTD REFERENCE DESIGN

4

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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