Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
ZMOTIONS200ZCOG

ZMOTIONS200ZCOG

Zilog / Littelfuse

KIT DEV ZMOTION INTRUSION

0

CY3280-MBR3

CY3280-MBR3

Cypress Semiconductor

BOARD EVAL CAPSENSE EXPRESS

37

LDC1614EVM

LDC1614EVM

Texas Instruments

EVAL MODULE FOR LDC1614

25

ASEK770LCB-100B-T-DK

ASEK770LCB-100B-T-DK

Allegro MicroSystems

BOARD DEMO 770LCB-100B SENSOR

0

VINCO-TOUCH

VINCO-TOUCH

Future Technology Devices International, Ltd.

VINCO TOUCH-KEY SHIELD

0

STEVAL-MKI192V1

STEVAL-MKI192V1

STMicroelectronics

LPS22HH ADAPTER BOARD FOR A STAN

45

4453

4453

Pololu Corporation

QTRX-MD-13A REF ARRAY 13CHNL

18

SEK-SHT35-SENSORS

SEK-SHT35-SENSORS

Sensirion

SHT35 SENSORS ON FLEX STRIP

67

MTI-3-DK

MTI-3-DK

Xsens

DEV KIT FOR MTI 1 SERIES

14

4313

4313

Pololu Corporation

QTRX-HD-13RC REF ARRAY 13CHNL

56

SEN-11295

SEN-11295

SparkFun

HIH6130 HUMIDITY/TEMP SENSOR

7

MICROFJ-SMTPA-30035-GEVB

MICROFJ-SMTPA-30035-GEVB

Sanyo Semiconductor/ON Semiconductor

J-SERIES 3MM 35U SMTPA

15

430BOOST-TMP006

430BOOST-TMP006

Texas Instruments

BOOSTER PACK ADP BOARD TMP006

4

1375

1375

Adafruit

AT42QT1012 TOUCH SENSOR BREAKOUT

157

EVKITEWV-20

EVKITEWV-20

Gas Sensing Solutions Ltd

EVALUATION KIT, ROBUST & LOW POW

13

EVAL-KXSS5-2057

EVAL-KXSS5-2057

ROHM Semiconductor

BOARD EVALUATION FOR KXSS5-2057

0

2021

2021

Adafruit

BREAKOUT ACCEL/MAG/GYR/TEMP 9DOF

0

STEVAL-MKI183V1

STEVAL-MKI183V1

STMicroelectronics

EVAL BOARD FOR LPS33HW

30

USEQMSKS221600

USEQMSKS221600

KEMET

EVAL KIT SENSOR USEQMSEA221680

1

1133

1133

Pololu Corporation

CARRIER FOR SHARP SENSORS

83

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

RFQ BOM Call Skype Email
Top