Evaluation Boards - Sensors

Image Part Number Description / PDF Quantity Rfq
EB01-I2C

EB01-I2C

Superior Sensor Technology

EVALUATION BOARD IC

4

CY3280-MBR

CY3280-MBR

Cypress Semiconductor

BOARD EVAL CAPSENSE EXPRESS

25

108207

108207

Basler

DAA4200-30MCI-MX8MM-VAR

0

EVAL-ADXRS800Z-M

EVAL-ADXRS800Z-M

Analog Devices, Inc.

EVAL BOARD FOR ADXRS800Z

0

ASEK710KLA-25CB-T-DK

ASEK710KLA-25CB-T-DK

Allegro MicroSystems

BOARD DEMO 710KLA-25CB SENSOR

5

CY8CKIT-024

CY8CKIT-024

Cypress Semiconductor

DEV KIT PROXIMITY SHIELD PSOC 4

21

AS5115-SS_EK_DB

AS5115-SS_EK_DB

ams

BOARD DEMO FOR AS5115

0

TMD3702VC-EVM

TMD3702VC-EVM

ams

EVAL MODULE FOR THE TMD3702VC

2

MOD-TC

MOD-TC

Olimex

EMBEDDDED THERMOCOUPLE MODULE

0

AR0221SR2C00SUEAH3-GEVB

AR0221SR2C00SUEAH3-GEVB

Sanyo Semiconductor/ON Semiconductor

2MP 1/2 CIS 0 DEG CRA IBG

3

VEML6035-SB

VEML6035-SB

Vishay / Semiconductor - Opto Division

EVAL BRD VEML6035

14

STEVAL-IFS012V2

STEVAL-IFS012V2

STMicroelectronics

EVAL DAUGHTER STTS75 8-TSSOP

0

MTI-100-2A8G4-DK

MTI-100-2A8G4-DK

Xsens

IMU DEVELOPMENT KIT

2

DK-20680A

DK-20680A

TDK InvenSense

EVAL BOARD FOR IAM-20680

3

MAX30110ACCEVKIT#

MAX30110ACCEVKIT#

Maxim Integrated

EVAL MAX30110 AND MAX30112

1215

MICRORB-SMTPA-10035-GEVB

MICRORB-SMTPA-10035-GEVB

Sanyo Semiconductor/ON Semiconductor

RB-SERIES 1MM 35U SMTPA

8

201875-003

201875-003

Watterott electronic

ACS724 CURRENT SENSOR BREAKOUT +

20

EVAL-ADXL375Z-S

EVAL-ADXL375Z-S

Analog Devices, Inc.

EVAL BOARD FOR ADXL375

0

LXE3302AR001

LXE3302AR001

Roving Networks / Microchip Technology

LX3302A ROTARY EVB

13

STEVAL-MKI062V1

STEVAL-MKI062V1

STMicroelectronics

BOARD EVAL ACCELEROMETER

0

Evaluation Boards - Sensors

1. Overview

Evaluation boards for sensors are specialized hardware platforms designed to test, validate, and develop sensor-based applications. These boards integrate sensor elements with processing units, communication interfaces, and power management modules. They play a critical role in accelerating product development cycles in industries such as IoT, industrial automation, healthcare, and consumer electronics by enabling rapid prototyping and performance characterization.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Temperature Sensor BoardsHigh-precision thermal sensing with digital/analog outputsClimate control systems, medical devices
Accelerometer Boards3-axis motion detection with programmable sensitivityVibration monitoring, fitness trackers
Pressure Sensor BoardsAtmospheric/differential pressure measurementWeather stations, automotive systems
Environmental Sensor BoardsMulti-parameter detection (humidity, gas, light)Smart agriculture, air quality monitors
Image Sensor BoardsHigh-resolution optical sensing with ISP integrationSurveillance cameras, machine vision

3. Structure and Components

Typical evaluation boards consist of: - Sensor element (MEMS, CMOS, or discrete transducers) - Microcontroller/SoC with ADC/DAC interfaces - Communication modules (I2C, SPI, UART, BLE/Wi-Fi) - Power management ICs and voltage regulators - Debugging interfaces (JTAG, SWD) - Auxiliary components (LED indicators, potentiometers) The PCB layout optimizes signal integrity while minimizing electromagnetic interference.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMinimum/maximum detectable valuesDetermines application suitability
AccuracyError margin vs. reference valuesImpacts system reliability
Sampling RateData acquisition frequencyDefines dynamic response capability
Power ConsumptionOperating current/voltage requirementsAffects battery life and thermal design
Interface TypeCommunication protocol compatibilityDictates system integration complexity

5. Application Areas

  • Industrial Automation: Predictive maintenance systems, process control
  • Healthcare: Wearable vital sign monitors, diagnostic equipment
  • Consumer Electronics: Smart home devices, mobile accessories
  • Automotive: Tire pressure monitoring, ADAS sensors
  • Aerospace: Structural health monitoring, navigation systems

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
STMicroelectronicsSTEVAL-MKI187V16-axis IMU with advanced calibration
Texas InstrumentsBOOSTXL-ULTRASONICUltrasonic sensing for distance measurement
Analog DevicesEVAL-ADICUP3029Low-power Cortex-M4F based platform
NXP SemiconductorsFRDM-FXS-MULTI-BMulti-sensor fusion for IoT applications

7. Selection Guidelines

Key considerations include: - Match sensor specifications to target application requirements - Verify compatibility with existing development ecosystems - Evaluate power budget and form factor constraints - Consider available software support (drivers, SDKs) - Assess calibration and certification requirements Example: For a wearable health monitor, prioritize low-power accelerometers with medical-grade accuracy.

8. Industry Trends

Emerging trends include: - Integration of AI accelerators for edge computing - Development of wireless sensor nodes with energy harvesting - Advancements in MEMS fabrication for higher sensitivity - Standardization of sensor fusion algorithms - Growth of open-source hardware ecosystems Market projections indicate a 12% CAGR through 2027 driven by IoT and Industry 4.0 adoption.

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