Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
LIGHT-02 OSEPP Electronics	LIGHT SENSOR MODULE	460
TBSHD-01 OSEPP Electronics	MOTOR SHIELD - 6122	0
HUMI-01 OSEPP Electronics	HUMIDITY & TEMP SENSOR MODULE	53
SCSHD-01 OSEPP Electronics	MOTOR AND SERVO SHIELD	664
LEDRD-01 OSEPP Electronics	LED MODULE - RED	514
ULTRA-01 OSEPP Electronics	PING ULTRASONIC	558
LS-00078 OSEPP Electronics	SERVO POWER BOARD UNASSEMBLED	129
4DTOUCH-01 OSEPP Electronics	4-DIGIT TOUCH SENSOR MODULE	600
PIR-01 OSEPP Electronics	PASSIVE INFRARED PIR SENSOR MOD	624
VOLT-01 OSEPP Electronics	VOLTAGE SENSOR MODULE	637
RTCSD-01 OSEPP Electronics	SD AND RTC BREAKOUT	852
LIGHT-01 OSEPP Electronics	OSEPP LIGHT SENSOR MODULE	0
LEDMX-01 OSEPP Electronics	LED MODULES MIXED PACK	806
HC-SR04 OSEPP Electronics	ULTRASONIC SENSOR MODULE	125
LINE-02 OSEPP Electronics	LINE FOLLOWER ARRAY	705
COLOR-01 OSEPP Electronics	OSEPP COLOR SENSOR MODULE	0
PIR-02 OSEPP Electronics	PASSIVE INFRARED PIR SENSOR MOD	86
16X2SHD-01 OSEPP Electronics	16 X 2 DISPLAY & KEYPAD SHIELD	74
PUSH-04 OSEPP Electronics	PUSH BUTTON MODULE	279
IRFOL-01 OSEPP Electronics	IR FOLLOWER MODULE	1019

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems