Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
REED-01 OSEPP Electronics	REED SWITCH MODULE	1329
LS-00080 OSEPP Electronics	SERVO POWER BOARD ASSEMBLED	216
IRDET-01 OSEPP Electronics	IR DETECTOR MODULE	0
POTEN-01 OSEPP Electronics	POTENTIOMETER MODULE	1022
PIEZO-01 OSEPP Electronics	PIEZO SENSOR MODULE	1331
LINE-01 OSEPP Electronics	OSEPP IR LINE SENSOR	635
LEDWH-01 OSEPP Electronics	LED MODULE - WHITE	665
FAN-01 OSEPP Electronics	FAN MOTOR MODULE	368
PROTO-01 OSEPP Electronics	OSEPP PROTOSHIELD	479
MSDS-01 OSEPP Electronics	OSEPP MICROSD SHIELD	939
LEDGN-01 OSEPP Electronics	LED MODULE - GREEN	615
COMP-01 OSEPP Electronics	OSEPP COMPASS SENSOR	200
LS-00077 OSEPP Electronics	SERVO POWER BOARD UNASSEMBELD	3
FTD-01 OSEPP Electronics	OSEPP FTDI BREAKOUT BOARD	3
TBMTD-01 OSEPP Electronics	TB6612 MOTOR DRIVER ARDUINO CMPT	917
I2CSHD-01 OSEPP Electronics	OSEPP I2C EXPANSION SHIELD	631
FLAME-01 OSEPP Electronics	FLAME SENSOR MODULE	906
MHUM-01 OSEPP Electronics	MOISTURE AND HUMIDITY BREAKOUT	208
BAL-01 OSEPP Electronics	ACCELEROMETER & GYRO BREAKOUT	0
LEDYL-01 OSEPP Electronics	LED MODULE - YELLOW	699

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems