Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-3569 MikroElektronika	BUCK 10 CLICK	2
MIKROE-3688 MikroElektronika	THERMO 13 CLICK	2
MIKROE-3567 MikroElektronika	PEDOMETER CLICK	5
MIKROE-3310 MikroElektronika	3D HALL 3 CLICK	0
MIKROE-3742 MikroElektronika	ACCEL 13 CLICK	4
MIKROE-3687 MikroElektronika	13DOF 2 CLICK	11
MIKROE-3663 MikroElektronika	DEVICEDRIVE CLICK	4
MIKROE-4387 MikroElektronika	BRUSHLESS 9 CLICK	5
MIKROE-3651 MikroElektronika	BUCK 13 CLICK	7
MIKROE-4153 MikroElektronika	9DOF 3 CLICK	17
MIKROE-3338 MikroElektronika	PRESSURE 8 CLICK	4
MIKROE-3118 MikroElektronika	HALL CURRENT 3 CLICK	0
MIKROE-4117 MikroElektronika	BT AUDIO 2 CLICK	3
MIKROE-3699 MikroElektronika	SECURE 6 CLICK	19
MIKROE-3107 MikroElektronika	COLOR 5 CLICK	0
MIKROE-3603 MikroElektronika	BAROMETER 2 CLICK	2
MIKROE-3292 MikroElektronika	CURRENT 2 CLICK	3
MIKROE-3213 MikroElektronika	COLOR 8 CLICK	3
MIKROE-3214 MikroElektronika	STEPPER 6 CLICK	4
MIKROE-3691 MikroElektronika	POT 3 CLICK	3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems