Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-4357 MikroElektronika	BRUSHLESS 12 CLICK	5
MIKROE-4352 MikroElektronika	DRIVER 2 CLICK	5
MIKROE-3325 MikroElektronika	POT 2 CLICK	2
MIKROE-3203 MikroElektronika	CAP WHEEL CLICK	4
MIKROE-3197 MikroElektronika	3D HALL 5 CLICK	4
MIKROE-3858 MikroElektronika	TFT BOARD 4 CAPACITIVE WITH FRAM	3
MIKROE-4464 MikroElektronika	SILABS CLICK SHIELD	4
MIKROE-4384 MikroElektronika	BT CLICK	3
MIKROE-4159 MikroElektronika	MP3 2 CLICK	4
MIKROE-3215 MikroElektronika	HEART RATE 6 CLICK	4
MIKROE-3859 MikroElektronika	TFT BOARD 5 CAPACITIVE WITH FRAM	3
MIKROE-3770 MikroElektronika	RTC 10 CLICK	7
MIKROE-3650 MikroElektronika	CHARGER 11 CLICK	4
MIKROE-3201 MikroElektronika	3XBUCK CLICK	8
MIKROE-3712 MikroElektronika	DAC 5 CLICK	8
MIKROE-3660 MikroElektronika	GNSS ZOE CLICK	7
MIKROE-3104 MikroElektronika	EXCELON-LP CLICK	3
MIKROE-3669 MikroElektronika	GYRO 5 CLICK	4
MIKROE-3737 MikroElektronika	BALANCER 3 CLICK	4
MIKROE-4125 MikroElektronika	STEPPER 14 CLICK	3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems