Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
MIKROE-2523 MikroElektronika	AC CURRENT CLICK	7
MIKROE-2624 MikroElektronika	STEPPER 5 CLICK	5
MIKROE-4325 MikroElektronika	LTE IOT 5 CLICK	14
MIKROE-951 MikroElektronika	BOARD ACCY EXPAND CLICK MIKROBUS	0
MIKROE-3917 MikroElektronika	LED DRIVER 7 CLICK	4
MIKROE-1882 MikroElektronika	DEV BOARD IR REFLECT CLICK	0
MIKROE-2025 MikroElektronika	HAPTIC CLICK	0
MIKROE-1032 MikroElektronika	BOARD GPS CLICK UART/I2C	167
MIKROE-2040 MikroElektronika	BUTTON G CLICK	18
MIKROE-1714 MikroElektronika	DEV BOARD GPS3	1
MIKROE-4138 MikroElektronika	STEPPER 10 CLICK	4
MIKROE-4262 MikroElektronika	I2C MUX 3 CLICK	15
MIKROE-1908 MikroElektronika	CLICK BRD 868MHZ ENOCEAN TCM310	2
MIKROE-3870 MikroElektronika	DUAL LIN CLICK	4
MIKROE-3351 MikroElektronika	4G LTE-APJ CLICK (FOR ASIA PACIF	7
MIKROE-4037 MikroElektronika	HEART RATE 2 CLICK	8
MIKROE-3044 MikroElektronika	4D-DISPLAY CLICK	8
MIKROE-3636 MikroElektronika	THERMO 12 CLICK	1
MIKROE-3133 MikroElektronika	SERVO CLICK	10
MIKROE-2815 MikroElektronika	RTD CLICK	2

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems