Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
MIKROE-3409

MIKROE-3409

MikroElektronika

ANALOG KEY CLICK

4

MIKROE-4382

MIKROE-4382

MikroElektronika

TOUCHPAD 3 CLICK

2

MIKROE-1996

MIKROE-1996

MikroElektronika

9DOF CLICK

0

MIKROE-2527

MIKROE-2527

MikroElektronika

4G LTE-E CLICK EUROPE

0

MIKROE-2245

MIKROE-2245

MikroElektronika

MATRIX R CLICK

0

MIKROE-1878

MIKROE-1878

MikroElektronika

DEV BOARD I2C ISOLATOR CLICK

40

MIKROE-2769

MIKROE-2769

MikroElektronika

THERMO 6 CLICK

1

MIKROE-3509

MIKROE-3509

MikroElektronika

TFT BOARD 5 CAPACITIVE

7

MIKROE-2564

MIKROE-2564

MikroElektronika

KEYLOCK CLICK

2

MIKROE-2458

MIKROE-2458

MikroElektronika

ECG CLICK BUNDLE

0

MIKROE-3857

MIKROE-3857

MikroElektronika

TFT BOARD 3 CAPACITIVE WITH FRAM

2

MIKROE-2501

MIKROE-2501

MikroElektronika

THERMO K CLICK

33

MIKROE-4118

MIKROE-4118

MikroElektronika

LTE IOT 3 CLICK

5

MIKROE-1433

MIKROE-1433

MikroElektronika

BOARD ADAPTER CLICK USB

8

MIKROE-4268

MIKROE-4268

MikroElektronika

LED DRIVER 8 CLICK

11

MIKROE-2818

MIKROE-2818

MikroElektronika

DHT22 2 CLICK

0

MIKROE-1585

MIKROE-1585

MikroElektronika

DEV BOARD OLED C

47

MIKROE-2917

MIKROE-2917

MikroElektronika

MCP16331 INV CLICK

0

MIKROE-4413

MIKROE-4413

MikroElektronika

CLOCK GEN 5 CLICK

5

MIKROE-2560

MIKROE-2560

MikroElektronika

SMOKE CLICK

3

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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