Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
AC243009 Roving Networks / Microchip Technology	SQI SUPERFLASH KIT 1	13
AC47H23A Roving Networks / Microchip Technology	T10 XPLAINED PRO EXTENSION KIT	9
AC320004-7 Roving Networks / Microchip Technology	KSZ8863 PHY DAUGHTER BOARD	0
AC320032-3 Roving Networks / Microchip Technology	BM64 BLUETOOTH RADIO DAUGHTER BO	2
AC320005-4 Roving Networks / Microchip Technology	HIGH-PERFORMANCE WQVGA DISPLAY M	0
AC320213 Roving Networks / Microchip Technology	24 BIT PASS THROUGH GFX CARD	4
ATQT7-XPRO Roving Networks / Microchip Technology	QT7 XPLAINED PRO EXTENSION KIT	7
AC243008 Roving Networks / Microchip Technology	SERIAL SUPERFLASH(R) KIT 2	2
AC240100 Roving Networks / Microchip Technology	PICTAIL PLUS EXPANSION BOARD	41
AC320007 Roving Networks / Microchip Technology	MAXTOUCH CURIOSITY PRO	59
ATWINC3400-XSTK Roving Networks / Microchip Technology	WILC3400 XPLAINED PRO STARTER KI	5
AC320214 Roving Networks / Microchip Technology	SSD1963 GRAPHICS BOARD	6
AC320004-6 Roving Networks / Microchip Technology	KSZ8061 PHY DAUGHTER BOARD	0
DM160233 Roving Networks / Microchip Technology	I/O STARTER EXTENSION	0
AC80T88A Roving Networks / Microchip Technology	CURIOSITY NANO TOUCH ADAPTER KIT	30
EDCA1 Roving Networks / Microchip Technology	MODULE ADAPTER BOARD ROHM E/G -	21
AC164131 Roving Networks / Microchip Technology	BOARD DAUGHTER USB PICTAIL PLUS	2
EV02N47A Roving Networks / Microchip Technology	EVB-LAN8770 CONVERTER BOARD	8
DM160235 Roving Networks / Microchip Technology	SINGLE CHANNEL LED DRIVER EXTENS	0
AC328904 Roving Networks / Microchip Technology	PIC32 AUDIO CODEC DAUGHTER CARD	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems