Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
AC320004-5 Roving Networks / Microchip Technology	KSZ8041 PHY DAUGHTER BOARD	5
ATZB-SAMR21-XPRO Roving Networks / Microchip Technology	SAMR21 ZIGBIT XPLAINED PRO EXTEN	3
AC164162 Roving Networks / Microchip Technology	CURIOSITY NANO ADAPTER	59
AC320005-5 Roving Networks / Microchip Technology	DISPLAY MODULE	2
AC164167 Roving Networks / Microchip Technology	TA100 8-PIN MIKROBUS SOCKET BOAR	9
DT100104 Roving Networks / Microchip Technology	ATECC608A TRUST PLATFORM KIT	10
AC243003 Roving Networks / Microchip Technology	SERIAL EEPROM PIM PICTAIL 4PACK	5
AC320005 Roving Networks / Microchip Technology	5.0" WVGA PCAP DISPLAY BOARD	1
AC164166 Roving Networks / Microchip Technology	TA100 14-PIN MIKROBUS SOCKET BOA	3
ATMBUSADAPTER-XPRO Roving Networks / Microchip Technology	MIKROBUS TO XPLAINED PRO ADAPTER	9
AC164126 Roving Networks / Microchip Technology	PICTAIL PLUS PROTOTYPE BRD 3PACK	6
DM160234 Roving Networks / Microchip Technology	GESTURE CONTROLLER EXTENSION	0
AC324954 Roving Networks / Microchip Technology	PIC32 AUDIO CODEC CARD AK4954	2
AC164156 Roving Networks / Microchip Technology	ATWINC1500 PICTAIL/PICTAIL PLUS	9
EV48S68A Roving Networks / Microchip Technology	EVB-LAN8770-RMII EVALUATION BOAR	15
AC164161 Roving Networks / Microchip Technology	QT8 XPLAINED PRO EXTENSION KIT	2
ATWILC3000-SHLD Roving Networks / Microchip Technology	WILC3400 SHIELD	10
EVB-KSZ8563 Roving Networks / Microchip Technology	KSZ8563 PLUG-IN EVALUTION BOARD	1
MSCC-1588-DB Roving Networks / Microchip Technology	TIMING SYNCHRONIZATION	0
AC89D55A Roving Networks / Microchip Technology	T9 XPLAINED PRO EXTENSION KIT	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems