ample-chip ample-chip
RFQ
BOM

Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
MAX33042ESHLD#

MAX33042ESHLD#

Maxim Integrated

SHIELD EVKIT FOR 5V CAN VERSION

313
MAX33012ESHLD#

MAX33012ESHLD#

Maxim Integrated

CAN TRANSCEIVER WITH +/-65V FP,

223
MAXREFDES132#

MAXREFDES132#

Maxim Integrated

EV KIT 1-WIRE SHIELD IBUTTON

817
MAXREFDES99#

MAXREFDES99#

Maxim Integrated

LED DRIVER SHIELD

15
MAX33053ESHLD#

MAX33053ESHLD#

Maxim Integrated

EVAL MAX33053 TXRX CAN

218
MAX22190PMB#

MAX22190PMB#

Maxim Integrated

PERIPHERAL MODULE FOR MAX22190

610
MAX30003WING2#

MAX30003WING2#

Maxim Integrated

ECG AFE FEATHER BRD

327
MAX31342SHLD#

MAX31342SHLD#

Maxim Integrated

EVAL MAX31342 RTC

3122
MAXREFDES89#

MAXREFDES89#

Maxim Integrated

ARDUINO SHIELD DC MOTOR DRIVER

10
MAX30003WING#

MAX30003WING#

Maxim Integrated

ECG AFE FEATHER BOARD

62117
MAXREFDES220#

MAXREFDES220#

Maxim Integrated

EVAL HEART RATE PULSE

54142
MAXREFDES130#

MAXREFDES130#

Maxim Integrated

EV KIT AUTOMATION SHIELD

4425
MAX33054ESHLD#

MAX33054ESHLD#

Maxim Integrated

EVAL MAX33054 TXRX CAN

310
MAX31825EVSYS1#

MAX31825EVSYS1#

Maxim Integrated

EVAL SYSTEM KIT FOR MAX31825 1-W

445
MAX33251ESHLD#

MAX33251ESHLD#

Maxim Integrated

EVAL MAX33251 TXRX RS232 1MBPS

29
MAX11131BOB#

MAX11131BOB#

Maxim Integrated

12-BIT 16CH 3MSPS ADCS WEXTERNAL

22
MAX14001PMB#

MAX14001PMB#

Maxim Integrated

PERIPHERAL MODULE THAT PROVIDES

220
MAX5318PMB#

MAX5318PMB#

Maxim Integrated

MAX5318PMB# PERIPHERAL MODULE

5
DS18B20EVKIT#

DS18B20EVKIT#

Maxim Integrated

PROG RESOLUTION 1-WIRE DGTL THER

10
MAXREFDES161#

MAXREFDES161#

Maxim Integrated

MBED- AND ARDUINO-COMPATIBLE HIG

16

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
RFQ BOM Call Skype Email
Top