Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
MAX1240PMB#

MAX1240PMB#

Maxim Integrated

PERIPHERAL MODULE FOR MAX1240

310

MAX31341SHLD#

MAX31341SHLD#

Maxim Integrated

EVKIT FOR LOW CURRENT REAL TIME

521

MAX22191PMB#

MAX22191PMB#

Maxim Integrated

PERIPHERAL MODULE FOR MAX22191

314

MAX14912PMB#

MAX14912PMB#

Maxim Integrated

PERIPHERAL MODULE FOR MAX14912

413

MAX13054AESHLD#

MAX13054AESHLD#

Maxim Integrated

EVAL MAX13054 CAN TRANSCEIVER

195

MAX33250ESHLD#

MAX33250ESHLD#

Maxim Integrated

EVAL DUAL TXRX RS232 MAX33250

434

MAX31343SHLD#

MAX31343SHLD#

Maxim Integrated

MAX31343 RTC SHIELD

512

MAX13053AESHLD#

MAX13053AESHLD#

Maxim Integrated

EVAL MAX13053 TXRX CAN

27

DS18B20EVSYS1#

DS18B20EVSYS1#

Maxim Integrated

PROG RESOLUTION 1-WIRE DGTL THER

9

MAX30101WING#

MAX30101WING#

Maxim Integrated

FEATHERWING MODULE WITH PULSEOX

928

MAX14661PMB1#

MAX14661PMB1#

Maxim Integrated

EVKIT FOR BEYOND-THE-RAILS 16:2

8

MAX31345ATA/VY+

MAX31345ATA/VY+

Maxim Integrated

IC CLOCK AND TIMING

0

MAX31345ATA/VY+T

MAX31345ATA/VY+T

Maxim Integrated

IC CLOCK AND TIMING

0

MAX31345GTA/VY+T

MAX31345GTA/VY+T

Maxim Integrated

IC CLOCK AND TIMING

0

MAXSHLD0003#

MAXSHLD0003#

Maxim Integrated

MAX5969 SHIELD DEVELOPMENT KIT.

0

MAX31345GTA/VY+

MAX31345GTA/VY+

Maxim Integrated

IC CLOCK AND TIMING

0

MAXSHLD0002#

MAXSHLD0002#

Maxim Integrated

MAX14940 SHIELD DEVELOPMENT KIT.

0

MAXWINGDEMO1#

MAXWINGDEMO1#

Maxim Integrated

LOW POWER, TEMPERATURE SENSOR AN

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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