Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
U004 M5Stack	PIR MOTION SENSOR (AS312)	131
M003 M5Stack	GPS MODULE W/ ANTENNA (NEO-M8N)	56
U024 M5Stack	I2C JOYSTICK UNIT (MEGA328P)	14
U003 M5Stack	RGB LED UNIT (SK6812)	41
M020 M5Stack	USB MODULE WITH MAX3421E	48
A077 M5Stack	ATOMIC PROTO DIY KIT	32
M024 M5Stack	BUS MODULE	67
U084 M5Stack	HALL EFFECT UNIT (A3144E)	0
U041 M5Stack	I/O HUB 1 TO 6 EXPANSION UNIT (M	25
K042-D M5Stack	ATOM HUB SWITCHD 2-RELAY KIT	0
U027 M5Stack	MINI BUTTON UNIT	55
U016 M5Stack	THERMAL CAMERA UNIT MLX90640	87
U023 M5Stack	MINI 3A RELAY UNIT	88
U032 M5Stack	MINI GPS/BDS UNIT (AT6558)	63
U088 M5Stack	TVOC ECO2 GAS UNIT SGP30	29
U082-X M5Stack	ESP32 PSRAM TIMER CAMERAX OV3660	0
U086 M5Stack	AMMETER UNIT ADS1115	27
K043 M5Stack	ATOM GPS KIT (M8030-KT)	82
M004 M5Stack	GSM MODULE SIM800L WITH MIC	25
U075 M5Stack	M5STICKC SERVO HAT	74

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems