Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
U017 M5Stack	ESP32 WROVER CAMERA OV2640	45
U105 M5Stack	DDS UNIT(AD9833)	0
A045 M5Stack	HEX RGB LED BOARD SK6812	18
M005 M5Stack	LORA MODULE FOR ESP32 DEV KIT	4
M019 M5Stack	PLUS MODULE WITH MEGA328P	32
U073 M5Stack	M5STICKC JOYSTICK HAT	72
M011 M5Stack	COMMU MODULE INTERFACE CONVERTER	70
U078 M5Stack	UNITV AI CAMERA	64
K047 M5Stack	ATOM STEPMOTOR DRIVER KITDRV8825	73
U079 M5Stack	JOYC (W/O M5STICKC)	7
K042 M5Stack	ATOM HUB SWITCH KIT	44
U035 M5Stack	CARDKB KEYBOARD UNIT (MEGA328P)	65
U025 M5Stack	MINI DUAL BUTTON UNIT	156
U006 M5Stack	1 TO 3 HUB UNIT	142
M001 M5Stack	PROTO MODULE WITH EXTENSIONS	109
M012 M5Stack	STEPMOTOR MODULE (DRV8825)	41
U009 M5Stack	COLOR SENSOR RGB UNIT (TCS3472)	101
T002 M5Stack	ATOM TAIL485	46
K012-C M5Stack	LAN W5500 ETHERNET POE BASE	18
U087 M5Stack	VOLTMETER UNIT ADS1115	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems