Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
TLE94112ELSHIELDTOBO1

TLE94112ELSHIELDTOBO1

IR (Infineon Technologies)

DC MOTOR SHIELD TLE94112EL

3

DCMOTORCONTRBTN8982TOBO1

DCMOTORCONTRBTN8982TOBO1

IR (Infineon Technologies)

KIT DC MOTOR BTN8982

151

MYIOTADAPTERTOBO1

MYIOTADAPTERTOBO1

IR (Infineon Technologies)

EVAL MY IOT ADAPTER

13

BTS70082EPADAUGHBRDTOBO1

BTS70082EPADAUGHBRDTOBO1

IR (Infineon Technologies)

PROFET +2 12V BTS7008-2EPA DAUGH

3

SHIELDBTS70041EPPTOBO1

SHIELDBTS70041EPPTOBO1

IR (Infineon Technologies)

BTS7004-1EPP SHIELD FOR ARDUINO

8

BTS3011TEDEMOBOARDTOBO1

BTS3011TEDEMOBOARDTOBO1

IR (Infineon Technologies)

BTS3011TE DEMOBOARD

3

SHIELDBTS70041EPZTOBO1

SHIELDBTS70041EPZTOBO1

IR (Infineon Technologies)

PROFET+2 12V GRADE0 BTS7004-1EP

3

KITXMC1300IFX9201TOBO1

KITXMC1300IFX9201TOBO1

IR (Infineon Technologies)

STEPPER MOTOR CONTROL SHIELD

3

SHIELDBTS70802EPZTOBO1

SHIELDBTS70802EPZTOBO1

IR (Infineon Technologies)

PROFET+2 12V GRADE0 BTS7080-2EP

3

SBCSHIELDTLE9471TOBO1

SBCSHIELDTLE9471TOBO1

IR (Infineon Technologies)

EVAL DCDC SBC SHIELD TLE9471-3ES

4

S2GO2HALLTLE4966KTOBO1

S2GO2HALLTLE4966KTOBO1

IR (Infineon Technologies)

TLE4966K DOUBLE HALL SHIELD2GO

13

SPOC2DBBTS710336ESATOBO1

SPOC2DBBTS710336ESATOBO1

IR (Infineon Technologies)

SPOC+2 BTS71330-6ESA DAUGHTERBOA

2

S2GO3DSENSETLV493DTOBO1

S2GO3DSENSETLV493DTOBO1

IR (Infineon Technologies)

3D MAGNETIC SENSOR

1

TPM7012XENONBOARDTOBO1

TPM7012XENONBOARDTOBO1

IR (Infineon Technologies)

EVAL TPM SLB9670 XENON

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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